Delphi Technologies, Inc.

Gm Global Technolgoy Operations, Inc.

Delco Electronics Corporation

Other

Mark Anthony Koors

Scott David Brandenburg

Andrew R Baker

Jeffery Ralph Daanen

Phillip A Lutz

Glen W Devos

William W Fultz

James Frank Patterson

Dennis P Griffin

Mark C Hansen

Gerald J Witt

Mark William Hudson

Timothy J Newman

Gary Eugene Oberlin

Ning Wu

Dale J Igram

Mark Robert Vincen

Jianhua Li

Charles I Delheimer

Doyle Joseph Groves

Robert Vajagich

Christopher M Puranen

James E Jung

A seat belt assembly includes a webbing, a resistive film attached to the webbing, and a connector. The connector further includes a first contact connected to first contact point on the resistive film and a second contact connected to a second contact point on the resistive film. The electrical resistance of the film between the first contact point and the second contact point is proportional to tension applied axially to the webbing. The first contact and the second contact are electrically connected to an electrical resistance measuring device.

Seat belt assembly including resistive film for determining tension

This invention relates generally to an apparatus design that minimizes fabrication and assembly costs for an omni-directional wheel.

Omni-directional wheel design for construction cost reduction

An apparatus for gathering weather related information is disclosed, in particular wind related information and rain related information, along with associated methods of using the apparatus. The apparatus may calculate at least one of a wind speed, a wind direction, and a rainfall amounts. The apparatus may include a controller, a sensor, and a communication member.

Weather/environment communications node

A fluid-filled seat bladder assembly includes multiple capacitive sensing elements for detecting variation in bladder deformation due to occupant weight. The bladder is defined by upper and lower elastomeric sheets that are peripherally sealed by welding, and the capacitive sensors are defined by metalized films adjoining the upper and lower elastomeric sheets. The bladder fluid separating the upper and lower metalized films acts as a dielectric material, and the capacitance or electric field coupling of each sensor increases when the separation between the respective upper and lower films decreases due occupant seat weight. The cumulative change in capacitance or electric field coupling reflects the total seated weight, and the individual capacitance or electric field coupling changes provide a profile of the pressure distribution across the seat for improved occupant classification. The metalized films may be located exterior of the bladder, or may be are formed on interior surfaces of the upper and lower elastomeric bladder sheets.

Fluid filled seat bladder with capacitive sensors for occupant classification and weight estimation

A propulsion mechanism is provided for driving a vehicle having a frame and socket. The propulsion mechanism has a spherical ball disposed within the socket and adapted to frictionally engage the ground surface. First and second powered drive members are frictionally engaged with the spherical ball and powered to rotate the spherical ball to propel the vehicle. The first and second powered drive members drive the spherical ball in first and second directions and may be operated simultaneously.

Propulsion mechanism having spherical ball

An electric circuit module has a case made of a non-magnetic material. The case has an attachment portion for fixed mounting on a vehicle part made of a magnetic material and a permanent magnet fixed within the case. The module further has a Hall effect sensor fixed within the case in positional relation to the permanent magnet and the attachment portion such that the Hall effect sensor generates a first signal when the attachment portion of the case is fixedly attached to the vehicle part and a second signal different from the first signal when the attachment portion of the case is not so mounted. The module also has an electric circuit in the case with circuit elements responsive to the Hall effect sensor to provide a first mode of operation in response to the first signal and a second mode of operation in response to the second signal. The module is particularly useful when at least one of the electric circuit elements is an accelerometer, for example in a vehicle passive restraint deployment system. In such an application, the Hall effect sensor output indicates the validity of the accelerometer output signal as an indication of accelerations of the vehicle part and can thus help control the use of the accelerometer signal in determining restraint deployment.

Electrical circuit module with magnetic detection of loose or detached state

The control settings of a vehicle climate control system are adjusted in accordance with a relative ambient humidity correction to compensate for variations in relative ambient humidity, and the correction is based on normally measured system operating parameters. The ambient humidity correction value is determined according to a difference between the cooling performance of the system and the ambient heat energy absorbed by the system. The cooling performance of the system is determined during an initial period of vehicle operation based on the time required to reduce the initial evaporator temperature by a predetermined amount. Once steady-state operation of the system is achieved, the cooling performance of the system is determined by the steady-state deviation of the evaporator outlet air temperature from a target temperature of the system. The ambient heat energy absorbed by the system is determined based on the temperature of the ambient air and the flow rate of air through the evaporator.

Ambient humidity compensation method for a vehicle climate control system

A method and assembly ( ) for conducting heat from a semiconductor device, such as a power flip chip ( ). The assembly ( ) is generally constructed to dissipate heat from the chip ( ) when mounted to a flexible substrate ( ). Heat is conducted from the chip ( ) with a heat-conductive member ( ) brought into thermal contact with the surface of the chip ( ) opposite solder bump connections ( ) that attach the chip ( ) to the substrate ( ). A biasing member ( ) biases the substrate ( ) against the chip ( ) so as to maintain thermal contact between the chip ( ) and the heat-conductive member ( ). A thermally-conductive lubricant ( ) is preferably provided between the surface of the chip ( ) and the heat-conductive member ( ) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip ( ), substrate ( ) and heat-conductive member ( ). The substrate ( ) and chip ( ) are preferably enclosed within a housing ( ) that incorporates the heat-conductive member ( ). The housing ( ) may further include fins ( ) in order to promote heat dissipation from the housing ( ) to the environment.

Heat-dissipating assembly for removing heat from a flip chip semiconductor device

An overmolded electronic assembly (,) and method for forming the assembly (,) that entails enclosing a circuit board (,) having one or more circuit devices (,) mounted to its surface. The assembly (,) includes a heat-conductive member (,) in thermal contact with one or more of the circuit devices (,) mounted to the circuit board (,). An overmolded body (,) encloses the circuit board (,) and the circuit devices (,) with the heat-conductive member (,), such that the overmolded body (,) and heat-conductive member (,) form a moisture-impermeable seal around the circuit board (,) and circuit devices (,). The overmolded body (,) also includes a connector housing (,) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (,) generally entails supporting the circuit board (,) with the heat-conductive member (,) such that the heat-conductive member (,) thermally contacts the circuit devices (,). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (,) to form the overmolded body (,) that, with the heat-conductive member (,), encases the circuit board (,) and its circuit devices (,).

Overmolded electronic assembly

A method and assembly for mounting an IC semiconductor device to a substrate using flip chip technology. The assembly generally entails a flip chip having a first surface, an oppositely-disposed second surface, an integrated circuit that includes a vertical device on the first surface, and an electrical contact for the vertical device on the second surface. The flip chip is bonded with first solder connections to a first conductor pattern on a substrate, so that the first solder connections electrically and mechanically connect the flip chip to the substrate. The assembly further includes an electrical contact member that is positioned so that the flip chip is between the contact member and the substrate. The contact member is electrically and mechanically connected to a second conductor pattern on the substrate with second solder connections. A third solder connection electrically and mechanically connects the contact member to the electrical contact on the second surface of the flip chip.

Flip chip with backside electrical contact and assembly and method therefor

A method and assembly (,) for conducting heat from a semiconductor device, such as a power flip chip (,). The assembly (,) is generally constructed to dissipate heat from the chip (,) when mounted to a flexible substrate (,). Heat is conducted from the chip (,) with a heat-conductive member (,) brought into thermal contact with the surface of the chip (,) opposite solder bump connections (,) that attach the chip (,) to the substrate (,). A biasing member (,) biases the substrate (,) against the chip (,) so as to maintain thermal contact between the chip (,) and the heat-conductive member (,). A thermally-conductive lubricant (,) is preferably provided between the surface of the chip (,) and the heat-conductive member (,) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip (,), substrate (,) and heat-conductive member (,). The substrate (,) and chip (,) are preferably enclosed within a housing (,) that incorporates the heat-conductive member (,). The housing (,) may further include fins (,) in order to promote heat dissipation from the housing (,) to the environment.

Method for removing heat from a flip chip semiconductor device

Method of forming an overmolded electronic assembly

A head up display system having a diffusing image plane or diffuser. The light output of a relatively small image source is imaged on the diffuser by way of imaging optics. A mirror is used to image light from the diffuser onto a windshield and correct for distortion caused by the windshield. The diffuser is advantageously used when a large field-of-view is desired, or sun load characteristics need to be addressed. The diffuser may be flat or curved in order to optimize the system for different applications. The magnification of the mirror may be made relatively low, and the solar energy density that is made incident on the image source is reduced, providing for a low cost, high performance, color head up display system.

Head up display system using a diffusing image plane

A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together, the inner surface of the outer ring contains recessed sockets for receiving socket pins upstanding on a circuit board.

Surface mountable integrated circuit package equipped with sockets

A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together.

Growing community of inventors

Kokomo, IN, United States of America

Mark Anthony Koors