Corning Incorporated

Fives Landis Corp.

Mark Andrew Stocker

Michael John Moore

Raymond Charles Cady

Mark Alex Shalkey

Lu Zhang

John Joseph Costello, Iii

James Joseph Bernas

Jeffrey Michael Amsden

Margaret Helen Gentile

Kishor Purushottam Gadkaree

Richard Orr Maschmeyer

John Christopher Thomas

Jiangwei Feng

Joseph Frank Mach

Steven Joseph Gregorski

Jeffrey Scott Cites

Charles Michael Darcangelo

Matthew Tucker

Paul Comley

A workpiece holding assembly comprises a magnetic chuck, and first and second separate sets of workrests for engaging with the outer circumferential surface of an annular workpiece. The workrests are configurable such that when the outer circumferential surface of the workpiece is ground with the chuck rotating in one direction, the outer circumferential surface is only urged in contact with the first set of workrests, and when an inner circumferential surface of said workpiece is ground with the direction of rotation of the chuck reversed, the outer circumferential surface is only urged in contact with the second set of workrests. Grinding methods using such a workpiece holding assembly are also described.

Workpiece holding assembly for a grinding machine and grinding methods

A machine tool is provided which comprises a machine base (), a first support () mounted on a first rotational machine axis on the base, and a second support () mounted on a second rotational machine axis on the base. The second rotational axis is parallel to and spaced laterally from the first rotational axis and carries a mount () moveable relative to the second support along a first linear machine axis orthogonal to the second rotational axis. A control arrangement is operable to control the orientation of the first support on the first rotational axis, and the orientation of the mount relative to the second rotational axis and its location along the linear axis, so as to govern the position and orientation of the first support and the mount relative to each other. Existing machine tools often use long linear guide rails and stacked orthogonal axes which introduce alignment and offset errors. The present invention avoids the need for and/or reduces the number of these structures in machine tools.

Machine tools and methods of operation thereof

A machine tool is provided which comprises a machine base; a first support provided on a first rotational machine axis, the first rotational axis being mounted on the base in a fixed position relative to the base; a second support provided on a second rotational machine axis, the second rotational axis being mounted on the base in a fixed position relative to the base, wherein the axis of rotation of the second rotational axis is parallel to and spaced laterally from the axis of rotation of the first rotational axis. A mount is carried by a support arm on the second support, with the support arm being moveable relative to the second support about a rotary axis. A control arrangement is operable to control the orientation of the first support relative to the axis of rotation of the first rotational axis, and the orientation of the mount relative to the axis of rotation of the second rotational axis and its rotational position about the rotary axis, so as to govern the position and orientation of the first support and the mount relative to each other. Combination of motion about three rotational axes in this way facilitates versatile and accurate control of the relative orientations of the first support and the mount on the second support. The machine base may include a central support located between the machine axes, with the machine axes mounted onto opposite sides of the support.

Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Polishing pad for polishing semiconductor surfaces

Methods and apparatus for forming a slurry polishing pad

An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates.

Method and apparatus for sealing a glass package

Apparatus for forming a slurry polishing pad

The spacing between an abrasive type surface polishing tool and the surface of the work piece that is being polished is controlled dynamically so that variations in the area of the abrasive pad in contact with the surface of the work piece compensated, thereby eliminating size variations in this contact area and the accompanying variations in material removal that produce surface height fluctuations.

Precision abrasive machining of work piece surfaces

Methods and apparatus for producing a semiconductor on glass (SiOG) structure include: subjecting an implantation surface of a donor semiconductor wafer to an ion implantation process to create an exfoliation layer in the donor semiconductor wafer; bonding the implantation surface of the exfoliation layer to a glass substrate using electrolysis; separating the exfoliation layer from the donor semiconductor wafer, thereby exposing at least one cleaved surface; and subjecting the at least one cleaved surface to a wet etching process.

Semiconductor on glass insulator made using improved thinning process

A method of polishing a semiconductor layer formed on a transparent substrate is described, the method including measuring the thickness of the semiconductor from the substrate side of the semiconductor layer simultaneously with the polishing, and using the thickness measurement to modify the polishing.

Growing community of inventors

Market Harborough, United Kingdom

Mark Andrew Stocker