Stmicroelectronics S.r.l.

Stmicroelectronics (malta) Ltd

Corning Incorporated

Stmicroelectrics S.r.l.

Stmicroelectronics Gmbh

Mark Andrew Shaw

Federico Giovanni Ziglioli

Luca Maggi

Antonio Fincato

Fulvio Vittorio Fontana

Mario Francesco Cortese

Matteo Alessio Traldi

Salvatore Mario Rotolo

Gianmarco Antonio Camillo

Luigi Verga

Lorenzo Baldo

Pierangelo Magni

Giovanni Graziosi

Chantal Combi

Caterina Riva

Filippo David

Giuseppe Gattavari

Alex Gritti

Kevin Formosa

Conrad Cachia

Mark Anthony Azzopardi

Fabrizio Soglio

Conrad Max Cachia

An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where the electrically insulating material partially covers the first surface so as to expose the optical zone.

Electro-optical system with an electrical integrated circuit over an optical integrated circuit

An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.

Opto-mechanical transducer apparatus and corresponding method

An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where he electrically insulating material partially covers the first surface so as to expose the optical zone.

Method for forming an electro-optical system

A method of forming a photonic device includes forming a cavity extending from a first major surface of a semiconductor wafer, performing a laser grooving process to form a first groove and a second groove, dicing the semiconductor wafer along the first groove and the second groove, and attaching an optical interposer to the bottom surface of the cavity. The cavity includes a first sidewall, an opposite second sidewall, and a bottom surface. The first groove is separated from the second groove by the cavity. The dicing passes through the cavity along a line connecting the first groove to the second groove.

Photonic devices and methods for formation thereof

An optical waveguide includes a glass waveguide body and a waveguide core through which optical radiation propagates. The waveguide core includes: a body portion extending within the waveguide body, a coupling portion extending at the surface of the waveguide body, and an S-bent intermediate portion coupling the body portion and the coupling portion. An optical coupling arrangement (e.g., for coupling one or more optical fibers to a silicon photonics device) includes one such optical waveguide and a second optical waveguide including a respective waveguide body and one or more waveguide members. The second optical waveguide is coupled with the first optical waveguide with the waveguide member(s) facing the coupling portion of the first optical waveguide.

Optical waveguide, corresponding coupling arrangement, apparatus and method

A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

Method of producing a device for adiabatic coupling between waveguide arrays, corresponding device, and system

A method includes providing a semiconductor wafer that includes at least one optical waveguide extending in a longitudinal direction. Stealth dicing laser processing is applied to the semiconductor wafer by producing defect regions into the wafer along at least one cutting line. The cutting line is oblique to the longitudinal direction of the at least one optical waveguide. The wafer is expanded to induce fracture thereof at the at least one cutting line, thereby producing an end surface of the at least one optical waveguide. The end surface is oblique to the longitudinal direction of the at least one optical waveguide.

Method of producing optical waveguides, corresponding system and device

An optical coupling includes a body having a first surface which couples with a photonics integrated circuit and a second surface including an array of lenses integral with the body. The array of lenses couples to an optical fiber connector. The array of lenses may be a linear array. The body may be made of a polymer material, which may be optically cured. The photonics integrated circuit and the optical coupling may be used, for example, in a mobile phone. The optical coupling may be made by shaping curable material on a photonics integrated circuit into a body, and curing the body of curable material. The cured body includes the first surface in contact with the photonics integrated circuit and the second surface including the array of optical lenses to couple with the optical fiber connector.

Optical coupling system, corresponding device and method

An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Optoelectronic device having improved optical coupling

An electro-optic device may include a photonic chip having an optical grating at a surface, and an IC coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path.

Electro-optic device with dichroic mirror and related methods

An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate. Also included are a plurality of electric connection elements, each adapted to electrically intercouple a respective contact element of the electronic assembly with a corresponding electric contact region of the electronic board, in such a way that the second main surface of the at least one support element faces the mounting surface of the electronic board.

Electronic assembly for mounting on electronic board

A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

Method of packaging a MEMS transducer device and packaged MEMS transducer device

An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.

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Milan, Italy

Mark Andrew Shaw