Mark Anders

Ram K Krishnamurthy

Kevin Lai Lin

Mauro J Kobrinsky

Himanshu Kaul

Embodiments disclosed herein include interconnect layers that include non-uniform interconnect heights and methods of forming such devices. In an embodiment, an interconnect layer comprises an interlayer dielectric (ILD), a first interconnect disposed in the ILD, wherein the first interconnect has a first height, and a second interconnect disposed in the ILD, wherein the second interconnect has a second height that is different than the first height.

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Hillsboro, OR, United States of America

Mark Anders