Air Products and Chemicals, Inc.

Other

Deposition Sciences Incorporated

Mark Allen George

Norman L Boling

John Irven

Dao-Hong Zheng

Ron D Clark

David A Bohling

Scott Edward Beck

Eric Krisl

Eric Anthony Robertson, Iii

Evan Craves

Miles Rains

Dao Hong Zheng

John "Midways" Irven

Rober H Gray

A system and method for feedforward control in thin film coating processes. A standard PID feedback control system that continuously monitors two or more process variables in a reactive sputtering process is combined with a feedforward control system to improve system performance. The control system enables much faster stabilization of the reactive sputtering process during target start-up, and improves control of the process once a steady-state operating condition has been reached following target start-up.

System and method for feedforward control in thin film coating processes

A combined refrigerator-oven () includes an enclosed chamber () having a top wall (), a bottom wall (), and vertical side walls (). The refrigerator-oven () further includes a heating unit () and a refrigeration unit (). A controller () is in communication with the heating unit () and the refrigeration unit (). When a cooling mode is selected, the controller () activates the refrigeration unit () to deliver cool air () into the enclosed chamber (). When a heating mode is selected, the controller () activates the heating unit () to produce heat () in the enclosed chamber ().

Combined refrigerator-oven apparatus

A modular gas control device for use with a compressed gas cylinder ( ) comprises a primary module ( ) and a secondary module ( ) mounted on the primary module. The primary module comprises a first supporting body ( ) having a first main gas flow path ( ) through the body. The supporting body has input connecting means ( ) for mounting the body on the cylinder ( ) and connecting the gas flow path ( ) to communicate with the gas cylinder through a first flow path ( ). Pressure reducing means ( ) provides gas in the flow path at a lower pressure than in the container. Output connecting means ( ) downstream of the pressure reducing means provides a low pressure outlet from the main gas flow path. A high pressure shut-off valve ( ) is positioned upstream of the pressure reducing means, and filling means ( ) allows filling of the cylinder with compressed gas through the input connecting means ( ) along a second flow path ( ) separate from the input flow path ( ). The secondary module ( ) has a corresponding supporting body ( ) and main flow path ( ) and corresponding output connecting means ( ) and corresponding input connecting means ( ) for mounting the secondary module ( ) on the primary module ( ). The supporting body ( ) of the secondary module has a combination of two or more functional components comprising means for measuring and/or varying parameters of gas flow in the second supporting body, and/or for switching and/or venting and/or mixing gas flow in the second supporting body.

Gas control device and method of supplying gas

A modular gas control device for use with a compressed gas cylinder ( ) comprises a primary module ( ) and a secondary module ( ) mounted on the primary module. The primary module comprises a first supporting body ( ) having a first main gas flow path ( ) through the body. The supporting body has input connecting means ( ) for mounting the body on the cylinder ( ) and connecting the gas flow path ( ) to communicate with the gas cylinder through a first flow. path ( ). Pressure reducing means ( ) provides gas in the flow path at a lower pressure than in the container. Output connecting means ( ) downstream of the pressure reducing means provides a low pressure outlet from the main gas flow path. A high pressure shut-off valve ( ) is positioned upstream of the pressure reducing means, and filling means ( ) allows filling of the cylinder with compressed gas through the input connecting means ( ) along a second flow path ( ) separate from the input flow path ( ). The secondary module ( ) has a corresponding supporting body ( ) and main flow path ( ) and corresponding output connecting means ( ) and corresponding input connecting means ( ) for mounting the secondary module ( ) on the primary module ( ). The supporting body ( ) of the secondary module has a combination of two or more functional components comprising means for measuring and/or varying parameters of gas flow in the second supporting body, and/or for switching and/or venting and/or mixing gas flow in the second supporting body.

A combined refrigerator-oven ( ) includes an enclosed chamber ( ) having a top wall ( ), a bottom wall ( ), and vertical side walls ( ). The refrigerator-oven ( ) further includes a heating unit ( ) and a refrigeration unit ( ). A controller ( ) is in communication with the heating unit ( ) and the refrigeration unit ( ). When a cooling mode is selected, the controller ( ) activates the refrigeration unit ( ) to deliver cool air ( ) into the enclosed chamber ( ). When a heating mode is selected, the controller ( ) activates the heating unit ( ) to produce heat ( ) in the enclosed chamber ( ).

A modular gas control device for use with a compressed gas cylinder (,) comprises a primary module (,) and a secondary module (,) mounted on the primary module. The primary module comprises a first supporting body (,) having a first main gas flow path (,) through the body. The supporting body has input connecting means (,) for mounting the body on the cylinder (,) and connecting the gas flow path (,) to communicate with the gas cylinder through a first flow path (,). Pressure reducing means (,) provides gas in the flow path at a lower pressure than in the container. Output connecting means (,) downstream of the pressure reducing means provides a low pressure outlet from the main gas flow path. A high pressure shut off valve (,) is positioned upstream of the pressure reducing means, and filling means (,) allows filling of the cylinder with compressed gas through the input connecting means (,) along a second flow path (,) separate from the input flow path (,). The secondary module (,) has a corresponding supporting body (,) and main flow path (,) and corresponding output connecting means (,) and corresponding input connecting means (,) for mounting the secondary module (,) on the primary module (,). The supporting body (,) of the secondary module has a combination of two or more functional components comprising means for measuring and/or varying parameters of gas flow in the second supporting body, and/or for switching and/or venting and/or mixing gas flow in the second supporting body.

The present invention is a process for thermal, vapor phase removal of silicon oxides and metal-containing contaminants from a surface of a substrate of a type used in manufacturing semiconductor devices comprising contacting the substrate at an elevated temperature at an elevated temperature appropriate to generate and maintain an effective amount of a cleaning reagent to form volatile by-products of the silicon oxides and the metal-containing contaminants and removing the volatile by-products from the surface, wherein the cleaning reagent is a complex of hydrogen fluoride and an oxygen-containing compound selected from the group consisting of one or more of trifluoroacetic acid, trifluoroacetic anhydride, 1,2-propanedione, a .beta.-diketone and a .beta.-diketoimine of the formula: ##STR1##

Gas phase removal of SiO.sub.2 /metals from silicon

A tool, comprising a head bolt stud and extractor, useful in the alignment of a cylinder head to an engine block when re-attaching the cylinder head to the engine block following replacement of the cylinder head seals.

Head bolt stud and extractor tool

This invention is a vapor-phase process for cleaning metal-containing contaminants from the surfaces of integrated circuits and semiconductors between the numerous fabricating steps required to manufacture the finished electronic devices. The process employs cleaning agents comprising an effective amount of hexamethyldisilazane. The process comprises contacting the surface to be cleaned with an effective amount of the desired cleaning agent at a temperature sufficient to form volatile metal-ligand complexes on the surface of the substrate to be cleaned. The volatile metal-ligand complexes are sublimed from the surfaces of the substrate providing a clean, substantially residue-free surface.

Gas phase cleaning agents for removing metal containing contaminants

Remote delivery system for potentially toxic moisture sensitive process gas to a point of use (e.g. CVD system).

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Santa Rosa, CA, United States of America

Mark Allen George