Schlumberger Technology Corporation

University System of Maryland

Services Petroliers Schlumberger

Schlumberger Holdings Limited

Mark Alex Kostinovsky

Steven O Dunford

Lweness Mazari

Francis Dupouy

Chandradip Pravinbhai Patel

F Patrick McCluskey

Gilles Iafrate

Suriyakan Vongtragool Kleitz

Glen Dell Schilling

A method of forming electronic substrates and assemblies is provided. The method includes forming a first layer, including co-depositing a first material and a second material, where the first material and the second material are co-deposited as powders, binders, slurries, inks, or combinations thereof, and at least partially sintering or curing the first layer of co-deposited materials. Further, the method includes forming a second layer, including co-depositing the first material and the second material, and at least partially sintering or curing the second layer of co-deposited materials. Additionally, the method includes retrieving a solid electronic substrate wherein the sintered or cured first material of the first layer forms the solid electronic substrate and the sintered or cured second material of the first layer forms a feature in or on the solid electronic substrate.

Additive manufacturing process of 3D electronic substrate

A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.

Additive manufactured 3D electronic substrate

A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.

Solder joints on nickel surface finishes without gold plating

A method for interconnecting a first conductor and a second conductor includes forming a layer of substantially pure copper on the first conductor, applying a copper sintering material to the first conductor, the second conductor, or both, and interconnecting the first conductor and the second conductor by sintering the copper sintering material so as to form a copper-copper interface that includes the layer of substantially pure copper, the second conductor, and the copper sintering material.

Interconnection of copper surfaces using copper sintering material

A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.

Tin-antimony-based high temperature solder for downhole components

The disclosure describes soldering a first component () to a second component () for use in a downhole circuit, device and/or tool. The first component () includes an electrically conductive contact region () finished with a metallic finish layer (). The soldering includes disposing a layer of manganese () adjacent to the metallic finish layer (), and applying solder () to the layer of manganese (). The solder () used in the soldering of the two components is a mixture of copper, silver and tin.

Growing community of inventors

Houston, TX, United States of America

Mark Alex Kostinovsky