Corning Incorporated

Brookhaven Science Associates, Lcc

Other

Mark Alejandro Quesada

Stephan Lvovich Logunov

Alexander Mikhailovich Streltsov

Bruce Gardiner Aitken

Wageesha Senaratne

Daniel Aloysius Nolan

Prantik Mazumder

Nicholas Francis Borrelli

James Scott Sutherland

Douglas Llewellyn Butler

Dana Craig Bookbinder

Jacques Gollier

Matthew John Dejneka

Michael Edward Badding

John J Dunn

Sean Matthew Garner

Heather Debra Boek

James Andrew West

Paul A Tick

Eric John Mozdy

Adra Smith Baca

Mark Alan Lewis

Po Ki Yuen

Shandon Dee Hart

Jin Su Kim

Robert Alan Bellman

Theresa Chang

Jianguo Wang

Santona Pal

Robert Adam Modavis

Robert George Manley

Shenping Li

Joydeep Lahiri

Dean Michael Thelen

Todd Parrish St Clair

Paul Arthur Sachenik

Yousef Kayed Qaroush

Indrajit Dutta

Leonard Charles Dabich, Ii

Shari Elizabeth Koval

David Eugene Baker

Wanda Janina Walczak

Chong Pyung An

Matthew Randesi

Norman Henry Fontaine

Glenn E Kohnke

David Alan Deneka

Victoria Ann Edwards

Cynthia Baker Giroux

Peter J Kalal

F William Studier

Anthony Glenn Frutos

Harbans S Dhadwal

David John McEnroe

Nadja Teresia Lönnroth

Pamela Arlene Maurey

Odessa Natalie Petzold

Ying Zhang

Youchun Shi

Benjamin Zain Hanson

Xiang-Dong Mi

Heather Bossard Decker

James Robert Lim

Joseph Edward McCarthy

Mandakini Kanungo

Ta-Ko Chuang

John Charles Speeckaert

Leo Young Zheng

Haregewine Tadesse Woldegiworgis

Yanfei Li

Louis Joseph Stempin, Jr

Christopher J Chase

Tracie Lynne Carleton

Glenn Eric Kohnke

Paul Arthur Tick

Leonard Charles Ii Dabich

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Sealed devices comprising transparent laser weld regions

Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.

Laser welding multiple refractive coated transparent substrates

A composite has repeating domains of an inorganic glass and a polymer, such that the inorganic glass and the polymer each have a glass transition temperature (T) or softening temperature of less than 450° C., and at least 50% of the inorganic glass domains have a length of less than 30 μm as measured along at least one cross-sectional dimension.

Organic-inorganic composites and methods of manufacturing thereof

Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Ultra low melting glass frit and fibers

Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

Methods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same

A method of making a glass article, for example a glass light guide plate comprising at least one structured surface including a plurality of channels and peaks. The glass article may be suitable for enabling one dimensional dimming when used in a backlight unit for use as an illuminator for liquid crystal display devices.

Methods of making a glass article with a structured surface

Described herein are glass substrates having oleophobic surfaces that are substantially free of features that form a reentrant geometry. The surfaces can include a plurality of gas-trapping features, extending from the surface to a depth below the surface, that are substantially isolated from each other. The gas-trapping features are capable of trapping gas below any droplets that are contacted with the surface so as to prevent wetting of the surface by the droplets.

Oleophobic glass articles

An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which &#x3c3;is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein &#x3c3;is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its &#x3c3;&#x3e;&#x3c3;, wherein &#x3c3;is peak value of compressive stress in the laser welded zone.

Laser welded glass packages

Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Assemblies, optical connectors and methods of bonding optical elements to substrates

Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

Assemblies, optical connectors and methods of bonding optical fibers to substrates

A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 &#x3bc;m, and the inorganic particle layer has an average thickness of less than or equal to 5 &#x3bc;m.

Sealed device housing with particle film-initiated low thickness laser weld and related methods

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((&#x3c3;)/(&#x3c3;))&#x3c;&#x3c;1 or &#x3c;1 and &#x3c3;&#x3e;10 MPa or &#x3e;1 MPa where &#x3c3;is the stress present in the first substrate and &#x3c3;is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Assemblies, optical connectors, and methods for forming fiber arrays using laser bonded optical fibers are disclosed. In one embodiment, a method of forming a fiber array includes placing an optical fiber on a surface of a substrate, directing a laser beam into the optical fiber disposed on the surface of the substrate, melting, using the laser beam, a material of the substrate to create a first laser bond zone between the optical fiber and the surface of the substrate, applying an adhesive to the optical fiber and the substrate to create an adhesive bond zone between the optical fiber and the surface of the substrate, and cutting the optical fiber and the substrate to create a first section of the fiber array and a second section of the fiber array. The first section of the fiber array includes a first portion of the optical fiber, a first portion of the substrate, a first portion of the adhesive bond zone, and the first laser bond zone, and the second section of the fiber array includes a second portion of the optical fiber, a second portion of the substrate, and a second portion of the adhesive bond zone.

Fiber array formed using laser bonded optical fibers

Growing community of inventors

Horseheads, NY, United States of America

Mark Alejandro Quesada