Sharp Laboratories of America, Inc

Elux, Inc.

Columbia University

Other

Sharp Kabushiki Kaisha Corporation

Mark Albert Crowder

Paul John Schuele

Apostolos T Voutsas

Changqing Zhan

Robert S Sposili

James S Im

Kenji Alexander Sasaki

Kurt M Ulmer

Sean Mathew Garner

Yasuhiro Mitani

Yasuhiro Mitiani

Yutaka Takafuji

Timothy James Kiczenski

David Robert Heine

Avinash Tukaram Shinde

Karen Yuri Nishimura

Masao Moriguchi

Hidayat Kisdarjono

Masahiro Adachi

Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.

Light emitting device and fluidic manufacture thereof

A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.

Method for the fabrication and harvest of piezoelectric plates

A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.

Counterbore pocket structure for fluidic assembly

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Diodes offering asymmetric stability during fluidic assembly

Embodiments are related to systems and methods for forming and using a top-contact disk.

Fluidic assembly top-contact LED disk

Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Substrate with topological features for steering fluidic assembly LED disks

A language communication device in the form of headphones. The headphones have two earpieces, each of the earpieces having a speaker, a first of the earpieces having a short range receiver for receiving audible signals representative of a first language, and a second of the earpieces having a short range transceiver. A microphone input unit is also provided. A control unit connected to the earpieces has a memory device and a translation unit for translating the first language into another language. Software resides in the control unit. A momentary switch is provided for allowing a user to access the software. The language communication device also has a mechanism for receiving a content stream such as music from an external source, which content stream can be muted when the momentary switch is pressed by the user or the short range receiver detects audible signals representative of a language.

Headphone-based language communication device

A method is provided for fabricating a thin-film electronic device employing a piezoelectric plate. The method provides a plurality of piezoelectric plates, and a substrate with electronic devices, each electronic device including a top surface well. A piezoelectric plate suspension is formed and flowed over the substrate. In response to the piezoelectric plate suspension flow, piezoelectric plates are captured in the top surface wells. The electric device top surface wells have well bottom surfaces, with bottom electrical contacts formed on the bottom surfaces. Thus, the capture of a piezoelectric plate in a top surface well entails interfacing a piezoelectric plate electrode, either the first electrode or the second electrode, to the bottom electrical contact. Subsequent to capturing the piezoelectric plates in the top surface wells, a thin-film process forms a conductive line overlying the exposed piezoelectric device electrode (i.e., the electrode not connected to the bottom electrical contact).

Fluidic assembly process using piezoelectric plates

A method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells formed in its top surface. A fluid stream is supplied to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks. The wells are filled with the LED disks. A first array of electrically conductive lines is formed over the substrate top surface to connect with a first contact of each LED disk, and a second array of electrically conductive lines is formed over the substrate top surface to connect with a second contact of each LED disk. An insulator over the disk exposes an upper disk (e.g., p-doped) contact region. A via is formed through the disk, exposing a center contact region of a lower (e.g., n-doped) disk contact region. Also provided are a top-contact LED disk and direct emission display.

Fabrication and harvest of piezoelectric plates

Embodiments are related to systems and methods for fluidic assembly, and more particularly to diodes offering orientation control properties in a fluidic assembly system.

Growing community of inventors

Portland, OR, United States of America

Mark Albert Crowder