International Business Machines Corporation

Mark Alan Brown

Thomas L Miller

Alan J Emerick

David W Sissenstein, Jr

David J Bajkowski

James Richard Murray

Daniel Stephen Potsko

Joseph A Apap

Richard Emerson Cole

A fluid treating device with at least one chamber, a plurality of ultrasonic transducers for imparting ultrasonic waves through fluid when present in the at least one chamber; a screen located in the at least one chamber wherein the screen is coated with a dielectric material. The coated screen diffuses the ultrasonic waves and enhances uniform treatment. The fluid treating device is useful for treatments such as cleaning, degreasing, plating or etching articles such as ceramic substrates.

Fluid treatment device and method

An improved method and apparatus for making solder connections from input/output connecting pins to the circuitry on a pinned metallized ceramic substrate. A solder preform in the shape of a sphere provides the correct volume of solder. These spheres are held in position at each desired joint by a templet. The substrate, solder sphere and templet assembly is passed through a furnace in a reducing atmosphere and at a temperature to facilitate solder reflow and wetting, thus creating a sound mechanical and electrical connection between the pin and its portion of the circuitry. The method and apparatus of the invention provides joints have a high degree of reliability such that all connections are made to acceptable soldering standards, none lacking integrity. Only harmless by-products are produced in the practice of the invention, and no residue is produced which requires cleaning by means of chemical solvents and therefore is environmentally superior.

Substrate soldering in a reducing atmosphere

Growing community of inventors

Whitney Point, NY, United States of America

Mark Alan Brown