Micron Technology Incorporated

Mark A Tverdy

William C Layer

Eric M Matthews

Lothar R Kress

Bradley R Bitz

Leland R Nevill

Shams U Arifeen

Michael R Slaughter

John Caldwell

João Elmiro Da Rocha Chaves

Kristopher D Hamrick

Kaleb A Wilson

James J Oleary

A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.

Printed wiring boards, printed wiring board assemblies, and electronic systems

Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).

Thermally conductive label for circuit

Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

Test sockets, test systems, and methods for testing microfeature devices

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM and guides it to a test site. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the associated test contacts. In one embodiment, the test site includes a module locator bar having a first arrangement of alignment pins configured for engagement with a plurality of tooling holes formed in an MCM presented at the test site. The module locator bar may be configured to be replaceable with a second module locator bar having a second, different arrangement of alignment pins such that differently configured MCMs may be accommodated and positively aligned at the test site.

Automated multi-chip module handler and testing system

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM, guides it at a test site, and positively ejects a tested MCM from the test site for sort and direction along an inclined track to either a shipping tray or a discard bin. After a magazine is emptied of MCMs, it continues to an output location where it is stacked with other empty magazines. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the test contacts. A particularly suitable magazine for use with the handler is also disclosed, as is a method of module handling.

A magazine for carrying a plurality of multi-chip modules (MCMs) in association with an automated MCM handler for automated module testing. The magazine includes a body defining a plurality of mutually parallel receptacles extending between two opposing body sides, each body side having a different height relative to the height of the receptacles. Each receptacle is separated from an adjacent receptacle by a baffle member. At least one notch ins formed in each baffle member so as to form at least one row of aligned notches extending across and contiguous with each receptacle. The aligned row of notches is configured to receive an elongated element for effectively altering the length of each receptacle. At least one recess is formed in an underside of the magazine and transversely intersects each receptacle. The magazine may also include structure to accommodate vertical stacking of the magazine with a plurality of like magazines.

Magazine for carrying a plurality of multi-chip modules

An automated method of handling multi-chip modules (MCMs) in conjunction with automated module testing. The method includes providing a plurality of MCMs in a magazine at an input location and positively displacing the magazine through an indexing device. At the indexing device, the MCMs are each positively retreived and guided to a test site, tested, and positively ejected for sorting according to the results of the testing. Depending on the testing results, the MCMs may be placed in a shipping tray or in a discard bin. The emptied magazine is further displaced to an output location where it may be stacked with similar emptied magazines.

Automated multi-chip module handler, method of module handling, and module magazine

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM, guides it at a test site, and positively ejects a tested MCM from the test site for sort and direction along an inclined track to either a shipping tray or a discard bin. After a magazine is emptied of MCMs, it continues to an output location where it is stacked with other empty magazines. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the test contacts.

An apparatus and method for controlling the environmental conditions surrounding an integrated circuit device during performance testing is disclosed. The apparatus includes a housing having an inlet and outlet, a test assembly having a plurality of device test sites, a heat transfer medium source connected to the inlet, a negative pressure source connected to the outlet to promote flow of the heat transfer medium from the inlet to the outlet, and at least one flow resistance member positioned between the test sites and the outlet to control the flow of the heat transfer medium proximate to the test sites. In a preferred embodiment the flow resistance member is integral with the test assembly and the test sites have at least one flow path through each of the test sites serving as the flow resistance member and sized to provide for a uniform flow field in the vicinity of the test sites. In the practice of the invention, the resistance member is positioned such that upon the application of a negative pressure on the outlet of the housing a uniform flow and pressure field develops in the vicinity of the test sites and devices.

Growing community of inventors

Boise, ID, United States of America

Mark A Tverdy