Intel Corporation

Mark A Trautman

Muralidhar Tirumala

Daniel R Sultenfuss

Paul B Koeneman

Francis E Parsche

Paul J Gwin

Rajiv K Mongia

Brian N Wright

Willem M Beltman

Peter A Davison

Curtis G Blount

George H Daskalakis

Stephen W Montgomery

Rolf A Konstad

Steve J Lofland

Nels E Jewell-Larsen

Wendell P Menard

Jr Dreher Wayne R

Thomas J Wheeler

Wayne R Jr Dreher

Rolf Konstad

Brian Wright

A method, apparatus, article of manufacture, and system, the method including, in some embodiments, processing a computational load by a first core of a multi-core processor, and dynamically distributing at least a portion of the computational load to a second core of the multi-core processor to reduce a power density of the multi-core processor for the processing of the computational load.

Method, system, and apparatus for dynamic thermal management

Method, system, and apparatus for dynamically distributing a computational load between clusters of cores at a frequency greater than a thermal time constant

A novel cold plate may include one or more of the following features: relatively narrow channel gaps, two or more flow paths, primarily non-linear flow paths, and/or tapered channel walls.

Cold plate

A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow to enhance an amount of heat the cooling fluid flow removes from an electronic component.

Cooling apparatus and method

A method and apparatus for cooling an integrated circuit die. An integrated circuit package comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit die. In one embodiment, an interposer is disposed between the integrated circuit die and a package substrate. The integrated circuit die and/or the interposer may have microchannels in its surface.

Method and apparatus for cooling an integrated circuit package using a cooling fluid

A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.

Low noise heatsink

According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Sealed and pressurized liquid cooling system for microprocessor

Cilia-like micro surface actuators are applied to fins of a heat sink to improve heat dissipation. The surface actuators act as active surface features whose motion disrupts the boundary layer fluid flow by entraining cool fluid towards the heat transfer surfaces of the fins and ejecting relatively warmer fluid away from the surfaces. This disruption reduces the thermal resistance between the heat sink fins and the fluid (e.g., the convection resistance). The motion of the surface actuators also induces a net flow along the surface of the fin(s) and can, therefore, be viewed analogously to a &ldquo;pump&rdquo; moving fluid (such as air) over the surface. The surface actuators can be fabricated using plastic microelectromechanical systems (MEMS) technology and can be actuated to generate their motion using several techniques.

Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations

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Aloha, OR, United States of America

Mark A Trautman