Qcept Technologies, Inc.

Nanohmics, Inc.

Mark A Schulze

Jeffrey Alan Hawthorne

M Brandon Steele

Yeyuan Yang

Jun Liu

Keith D Jamison

Michael G Durrett

Daniel Shedd

William R Usry

A method and system for inspecting a surface of a material having a repeating pattern of relative work function. The method and system processes sensor data to identify data characteristic of the repeating pattern, and the sensor data is then further processed to remove the data characteristic of the repeating data, leading to a characteristic of non-uniformities of the material surface.

Patterned wafer inspection system using a non-vibrating contact potential difference sensor

A display system for a parachutist is provided based on navigation data and calculations of locations where the parachutist should steer the parachute to increase likelihood of reaching a target. A two-dimensional representation of a navigation funnel is displayed. The display may increase situational awareness by use of color to indicate preferred positions in the navigation funnel.

Navigational display for parachutists

A method and system for identifying and classifying non-uniformities on the surface of a semiconductor or in a semiconductor. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor to detect the locations of non-uniformities, extracting features characteristic of the non-uniformities, and applying a set of rules to these features to classify the type of each non-uniformity.

Defect classification utilizing data from a non-vibrating contact potential difference sensor

A method and system for determining the contact potential difference of a wafer surface using a non-vibrating contact potential difference probe and a vibrating contact potential difference probe. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor, integrating and scaling the resulting data, and applying offsets to individual tracks of data to match the integrated scaled data to measurements made using a vibrating contact potential difference sensor.

Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion

A method and system for identifying a defect or contamination on the surface of a semiconductor or in a semiconductor. The method and system involves providing a semiconductor with a surface, such as a semiconductor wafer, providing a non-vibrating contact potential difference sensor, providing a source of illumination with controllable intensity or distribution of wavelengths, using the illumination source to provide controlled illumination of the surface of the wafer under or near the non-vibrating contact potential sensor probe tip, using the non-vibrating contact potential difference sensor to scan the wafer surface during controlled illumination, generating data representative of changes in contact potential difference across the wafer surface, and processing that data to identify a pattern characteristic of a defect or contamination.

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Austin, TX, United States of America

Mark A Schulze