Ford Motor Company Limited

Siemens Automotive Corporation

Mark A Parsons

Horst Belau

Charles R Cook, Jr

Marten Swart

Canice Patrick Boran

A single chip sensor processor includes an integrated analog to digital converter (A/D) and digital filter. Analog acceleration signals from a sensor is converted and digitally filtered on-chip in parallel with other processor software executions to effectively increases the bandwidth of the system. The results of the sensor processor calculations may be communicated to a remote microcontroller for deploying a vehicle air bag.

Sensor processor integrated circuit

A control arrangement for a deployable airbag of a vehicle is provided with first and second airbag controllers for receiving a fault signal at the first airbag controller, and for producing at the second airbag controller a deployment command signal that indicates that the deployable airbag is to be deployed. The second airbag controller receives the deployment command signal, and is provided with a communication controller for receiving the deployment command signal, a squib for firing in response to the deployment command signal whereby the deployable airbag is deployed, and an energy transfer arrangement coupled to the communication controller and the squib for transferring a deployment energy to the squib in response to the deployment command signal. The squib is configured to require a predeterminable minimum quantum of energy to effect the firing thereof in response to the deployment command signal. A heater is coupled to an energy transfer arrangement for receiving a second electrical energy from the energy transfer arrangement and providing preheat to the squib in response to the second electrical energy, whereby the predeterminable minimum quantum of energy applied to effect firing of the squib is exceeded by a combination of the first electrical energy and the preheat energy, which is monitored and controlled.

Airbag squib with silicon circuit and energy storage

A control arrangement for a deployable airbag of a vehicle is provided with a squib for firing in response to a deployment command signal whereby the deployable airbag is deployed. Bilateral communication is effected between the control arrangement and an airbag electronic controller. Electrical energy and data, including the deployment command signal are conveyed to the control arrangement, and at least self-diagnosis information is conveyed to the airbag electronic controller. The squib is configured to require a predeterminable minimum quantum of energy to effect the firing thereof in response to the deployment command signal. A heater provides a radiated preheat to the squib, whereby the predeterminable minimum quantum of energy applied to effect firing of the squib is exceeded by a combination of the first electrical energy and the radiated preheat energy. The squib and the preheater preferably are both formed on a silicon substrate using a conventional integration process. The radiated preheat energy is monitored and controlled, and the energy required to effect firing of the squib is proportional to the difference between temperature of the squib, in response to the radiated preheat energy, and the predeterminable firing threshold temperature of the squib.

Airbags squib with temperature bias

A hermetically protected electronic assembly that has (a) a housing having walls defining a shallow impervious cavity with a depth no greater than 6-12 mm and with an cavity bottom surface; (b) conductor pins extending through integrally said housing walls and along the cavity bottom surface; (c) an insulating supporting platform resting on the cavity bottom surface with ends of the conductor pins extending therethrough to secure the position of the platform, the platform carrying an electrical circuit integrated to at least the top surface of the platform and connected to the conductor pins; (d) at least one electronic sensor component supported in the housing by the platform and operatively secured to the circuit; and (e) a water-proofing silicon gel filling the entire space within the housing including surrounding the circuit, platform, sensor and pin connections therein.

Hermetically protected sensor assembly

An apparatus for packaging a vehicle sensor and integrated circuit chip includes a ceramic substrate having an opening formed therein. A sensor is secured within the opening. An integrated circuit chip is secured within the opening in electrical communication with the sensor. A pair of electrical connectors are secured on the ceramic substrate in electrical communication with the integrated circuit chip. A metal lid is secured over the opening on the ceramic housing to enclose the integrated circuit chip and sensor. A molded plastic coating encloses the ceramic housing and metal lid, and the electrical connectors extend from the plastic coating. The sensor may be a pressure sensor or acceleration sensor.

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Rochester, MI, United States of America

Mark A Parsons