Harris Corporation

Intersil Americas Inc.

Mark A Kwoka

Jack H Linn

Randolph Cruz

Loyde Milton Carpenter, Jr

Michael L Colquitt

Robert D Gerke

Dennis M Foster

One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.

Apparatuses and methods for encapsulated devices

A method of making a lead finish incorporating mechanically flattening the plated coating of metal leads. This may be accomplished by mechanical means such as rolling, stamping, peening, coining, forging, or other suitable flattening techniques.

Method of manufacturing a plated electronic termination

A method of plasma cleaning semiconductor wafers for subsequent soldering the dice cut from the semiconductor wafers to a substrate. The plasma cleaning removes all contaminants such that the semiconductor dice has improved solderability.

Method for cleaning semiconductor wafers to improve dice to substrate

A pallet for conveying a plurality of ceramic leadless chip carriers (LCC) through an automated wave soldering machine. The pallet includes recesses formed to receive and contain the LDD's with the lid of the LCC facing into the recess. This results in protecting the lids from the molten solder. Additionally, the recesses are formed in a diamond orientation with a solderable pin placed at the trailing apex of each recess. Both the pin and the diamond orientation prevents solder build up on the trailing conductive pads, resulting in enhancing the coplanarity of the solder on the pads.

Chip carrier soldering pallet

The lead finish can be greatly improved on leaded electronic components in a vapor phase reflow process without extra process steps by providing an improved conveyor belt having supports for carrying the components in bug down orientation while preventing the leads from substantially protruding through the plane of the conveyor mechanism and simultaneously allowing for the free flow of the heated vapor through the conveyor belt and on top of the belts such that the leads of the electronic components rest on the tape. The remaining portion of the belt is of a large grid mesh to permit the free flow of vapors in the upper portion of the reflow chamber.

Growing community of inventors

Palm Bay, FL, United States of America

Mark A Kwoka