Avago Technologies General IP (Singapore) Pte. Ltd.

Mark A Hinton

Nurwati Suwendi Devnani

Regee Petaja

Adam Gallegos

John Connor

Lin Wang

Minh V Quach

A system for using a reference plane to control transmission line characteristic impedance includes a signal trace located in a multi-layer structure and at least one constant thickness reference plane proximate to the signal trace, the constant thickness reference plane located with respect to the signal trace so as to provide a desired characteristic impedance between the signal trace and the constant thickness reference plane.

System and method for using a reference plane to control transmission line characteristic impedance

A laminate interconnect structure includes a core material and at least one additional layer adjacent the core material, a first electrically conductive via formed in the core material, and a second electrically conductive via formed in the core material, coaxial with the first electrically conductive via and separated from the first electrically conductive via by a non-conductive material.

Laminate interconnect having a coaxial via structure

A ball grid array (BGA) and via pattern includes a printed circuit board (PCB) having a surface on which a plurality of regions are formed and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

Ball grid array (BGA) and printed circuit board (PCB) via pattern to reduce differential mode crosstalk between transmit and receive differential signal pairs

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Fort Collins, CO, United States of America

Mark A Hinton