International Business Machines Corporation

Globalfoundries Inc.

Mark A DiRocco

Kirk David Peterson

Norman Whitelaw Robson

Keith C Stevens

Jeffrey P Gambino

Alfred J Brignull

William E Bentley, Jr

Nathanial W Bowe

Michael T Coster

Thomas C Rudick

According to a method herein, a multi-level inductor is created around a through-silicon-via (TSV) in a semiconductor substrate. A voltage induced in the multi-level inductor by current flowing in the TSV is sensed, using a computerized device. The voltage is compared to a reference voltage, using the computerized device. An electrical signature of the TSV is determined based on the comparing the voltage to the reference voltage, using the computerized device.

Signal monitoring of through-wafer vias using a multi-layer inductor

Aspects of the present invention relate to methods of testing an integrated circuit of a wafer and testing structures for integrated circuits. The methods include depositing a sacrificial material over a first conductor material of the integrated circuit, and contacting a test probe to the deposited sacrificial material. The methods can also include testing the integrated circuit using the test probe contacting the sacrificial material. Finally, the methods can include removing the sacrificial material over the first conductor material of the integrated circuit subsequent to the testing of the integrated circuit.

Methods for testing integrated circuits of wafer and testing structures for integrated circuits

A method and structure for encoding information on an integrated circuit chip. The method includes selecting a set of chip pads of the integrated circuit chip for encoding the information; encoding the information during a wirebonding process, the wirebonding process comprising forming ball bonds on chip pads of the integrated circuit chip and wedge bonds on leadframe fingers adjacent to one or more edges of the integrated circuit chip, the ball bonds and the wedge bonds connected by respective and integral wires; and wherein the information is encoded by varying one or more wirebonding parameters on each chip pad of the set of chip pads, the wirebonding parameters selected from the group consisting of the location of a ball bond, the diameter of a ball bond, both the location and diameter of a ball bond, the location of a wedge bond and combinations thereof.

Information encoding using wirebonds

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South Burlington, VT, United States of America

Mark A DiRocco