U.S. Philips Corporation

Mark A De Samber

Gerjan F Van De Walle

Tom Van Zutphen

Erwin A Hijzen

Ron Kroon

Frederik C Gehring

Henricus G R Maas

Wilhelmus C Peters

Christoph Schiller

Lambertus G J Fokkink

An X-ray examination apparatus (,), including an X-ray source (,) and an X-ray detector (,), is provided with an X-ray filter (,) which is arranged between the X-ray source and the X-ray detector. The X-ray filter (,) includes a plurality of filter elements (,) whose X-ray absorptivity can be adjusted by adjustment of a quantity of X-ray absorbing liquid (,) within the individual filter elements; a first end of individual filter elements communicates with the X-ray absorbing liquid whereas a second end communicates with an X-ray transparent liquid (,). The X-ray filter is preferably provided with a pressure control system for independent control of the liquid pressure in individual row ducts (,) and individual column ducts (,). Individual filter elements are preferably provided with a piston for separating the X-ray absorbing liquid from the X-ray transparent liquid.

X-ray examination apparatus comprising a filter

A method of manufacturing enveloped semiconductor devices, in which use is made of a slice of a semiconductor material which is provided on its first side with an intermediate layer of an insulating material on which a top layer of a semiconductor material is formed, semiconductor elements are formed in the top layer, paths of the slice's surface situated on this side being left clear between the semiconductor elements, and the top layer is removed from the insulating intermediate layer at the location of the free paths. A metallization with connection electrodes extending as far as the free paths are formed on the first side of the slice, the slice is glued with its first side onto a transparent insulating supporting body, semiconductor material is removed from the second side of the slice facing away from the first side, and the slice thus reduced in thickness is provided on its second side with a layer of an insulating material. Grooves are formed in the supporting body, at the location of the free paths, which grooves intersect the connection electrodes of the metallization and extend into the layer of insulating material provided on the second side of the slice, conductor tracks are formed on the supporting body, which extend in the grooves so as to make contact with the connection electrodes intersected in the grooves, and the slice is divided, along the grooves, into separate semiconductor devices enveloped by the supporting body and the insulating layer provided on the second side.

Method of manufacturing semiconductor devices with &ldquo;chip size package&rdquo;

The invention relates to an electric component (surface mountable component) which can be mounted on the surface of a printed circuit board. Such a component includes a thin, electroconductive layer or stack of layers which is provided with end contacts and arranged on a support of an electrically insulating material. In accordance with the invention, the dimension of the layer or stack of layers in at least one direction parallel to the surface of the support is smaller than the dimension of the support in the direction, while leaving portions of the surface of the support clear on at least two sides of the layer or stack of layers, and end contacts for the layer or stack of layers are situated on the surface portions of the support which are free of this layer or stack of layers, the thickness of the end contacts being larger than the thickness of the layer or stack of layers.

Electric component which can be mounted on the surface of a printed

Semiconductor device with a semiconductor cathode having an emissive part (pn junction) separated from a contact part which has locations at which a controlled breakdown occurs on a contact part metallization at excessive voltages, so that, during manufacture and operation, the emissive part in an election tube is protected from damage.

Semiconductor cathode and electron tube comprising a semiconductor

Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components. The invention relates to an electric component (surface mountable component) which can be mounted on the surface of a printed circuit board, and to a method of manufacturing said component. Such a component comprises a thin, electroconductive layer or stack of layers which is provided with end contacts and arranged on a support of an electrically insulating material. In accordance with the invention, the dimension of the layer or stack of layers in at least one direction parallel to the surface of the support is smaller than the dimension of the support in said direction, while leaving portions of the surface of the support clear on at least two sides of the layer or stack of layers, and end contacts for the layer or stack of layers are situated on the surface portions of the support which are free of this layer or stack of layers, the thickness of said end contacts being larger than the thickness of the layer or stack of layers. The method in accordance with the invention enables small-size electric components to be manufactured in which the end contacts form a reliable electric connection with the electroconductive layer or stack of layers of the component.

Method of manufacturing an electric component which can be mounted on

A method of manufacturing a semiconductor device is disclosed in which semiconductor switching elements (2) and an integrated microcomponent (3) with a fixed electrode (6) and an electrode (7) which is movable relative to the fixed electrode (6) are provided adjacent a surface of a semiconductor slice (1), which slice (1) is subsequently subdivided into individual semiconductor devices. After the semiconductor switching elements (2) have been provided, metal conductor tracks (20) of a first level are provided on the surface which form the fixed electrode (6) and electrical connections (9), over which an insulating layer (21) and metal conductor tracks (22) of a second level are provided, which form the movable electrode (7) and further electrical connections (8), after which the insulating layer (21) between the fixed (6) and the movable electrode (7) is removed. The semiconductor switching elements (2) are thus manufactured first, after which during the application of the metallization of the device the microcomponent (3) is also manufactured. Since the electrodes (6, 7) of the microcomponent are manufactured by means of conductor tracks (20, 22) at the two metallization levels, it suffices to adapt the metallization stage ('back end') of the manufacturing process only for the creation of a microcomponent (3). A standard process may accordingly be taken for the manufacture of the semiconductor elements (2). The manufacture of the device thereby becomes simpler and cheaper.

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Eindhoven, Netherlands

Mark A De Samber