International Business Machines Corporation

Mark A Brandon

Eric James McKeever

Michael J Ellsworth, Jr

Randall G Kemink

Levi A Campbell

Amilcar R Arvelo

Alan Frederic Benner

Edward Joseph Seminaro

John G Torok

Shawn Canfield

Tan D Doan

Robert K Mullady

David L Edwards

John J Loparco

Robert R Genest

Thong N Nguyen

Emanuele F Lopergolo

Edward F Furey

Arden Steuart Lake

Lawrence G Cook

Ronald E Bischoff

Joseph M Sullivan, Jr

John J Caulfield

George B Uplinger

Budy D Notohardjono

Gary Franklin Goth

Michael J Fisher

Dennis R Barringer

Richard M Ecker

Ethan E Cruz

John R Lankard, Jr

Joseph P Corrado

David Lee Gilbert

Methods of fabricating cooling apparatuses are provided, which include providing a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)

Aspects of the present invention include an optical fiber connector for connecting optical fibers. The optical fiber connector includes a ferrule coupled to one or more optical fiber ribbons. The optical fiber connector includes a connector housing coupled with a radius controlled ribbon bending housing. The connector housing surrounds the ferrule on at least four sides, and the one or more optical fiber ribbons coupled to the ferrule are within the connector housing. The optical fiber connector includes a strain relief clamp coupled with the radius controlled ribbon bending housing.

Blind mating strain relieved optical fiber connector

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.

Selective clamping of electronics card to coolant-cooled structure

A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

System to improve an in-line memory module

Aspects of the present invention include an optical fiber routing mat for routing optical fibers. The optical fiber routing mat includes a first layer of material and a second layer of material. A surface of the first layer of material is adhesively coupled to a surface of the second layer of material. The optical fiber routing mat includes one or more optical fibers disposed between the first layer of material and the second layer of material. The one or more optical fibers are bent to a radius at least large enough to prevent damage to the one or more optical fibers.

Optical fiber routing mat

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)

Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.

A method and incorporated assembly for enhancing structural rigidity of a computer rack used for housing electronic components is provided. In one embodiment, the assembly comprises a casing made of a lighter weight material and having protrusions. The protrusions are formed to receive one or more ruggedized inserts that is made of a heavier and/or stiffer material. The casing and the inserts together can be then used as a ruggedized side of a computer rack or cage.

Assembly and method for ruggedizing computer racks and/or electronic cage assemblies

A method and incorporated automatic air blockage assembly door is provided. The assembly comprises an air blockage door secured to a frame, capable of moving from a first to a second position via a pivot block and a shaft. The movement of the door is enabled by securing the door via the pivot block to an arm mechanism. The mechanism includes a pivot member and an activation pin. The activation and deactivation of the pin causes the movement of the door.

Automatic air blockage assembly and method for computing environments

A dual-blower assembly includes a single blower housing, the single blower housing defined by a base and opposite top, a pair of opposing side walls and a pair of opposing end walls intermediate the base and the top; a pair of inlet openings in the top; a front blower and a rear blower serially packaged in the single blower housing in a same plane, each blower aligned with a respective inlet opening of the pair of inlet openings; a rear blower exhaust opening for the rear blower disposed in one of the pair of end walls proximate the rear blower; and a front blower side exhaust opening for the front blower disposed in one of the pair of opposing side walls, the front blower side exhaust opening aligned with the front blower. Both the front and rear blowers are configured to force air in a direction from the front blower to the rear blower.

System for airflow management in electronic enclosures

An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.

Process for electroplating pins of an integrated circuit package

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Poughkeepsie, NY, United States of America

Mark A Brandon