Multek Technologies Limited

Flex Ltd.

Mark A Bergman

Joan K Vrtis

Michael James Glickman

Shurui Shang

Anthony Joseph Piazza

Mudhafar Hassan-Ali

Adam M Whiton

Yolita C Nugent

Phuocan N Nguyen

Jeffrey B Cross

Franz Gisin

Connor Meehan

Allison E Bowles

Biren Salunke

Dennis T Nguyen

Eva W Maskalenko

Srinivasa Varadan Rajagopalan

Syed Muhammad Abdullah

Embodiments of the disclosure provide a flexible and stretchable textile composite including an electrophoretic film. According to one embodiment, a textile composite material can comprise a textile base layer, a first flexible, optically transparent film layer deposited onto and affixed to the textile base layer, and an electrophoretic film layer disposed onto the first flexible, optically transparent film layer on a side of the first flexible, optically transparent film layer opposite the textile base layer. The electrophoretic film layer can comprise a plurality of relief cuts therein. The plurality of relief cuts can allow the electrophoretic film layer to flex or stretch in at least one direction.

Additive manufacturing of highly flexible electrophoretic film and textile composites

Embodiments of the disclosure provide systems and methods for a garment comprising a fabric layer, a plurality of biometric sensors integrated into the fabric layer, and a connectivity layer integrated into the fabric layer. The connectivity layer can comprise signal conductors and power conductors coupled with each of the plurality of biometric sensors. The garment can further comprise a power source coupled with each of the power conductors and providing, via the power conductors of the connectivity layer, electrical power to each of the plurality of biometric sensors, a signal monitor coupled with the connectivity layer and receiving, via the signal conductors of the connectivity layer, a signal comprising biometric information from each of the plurality of biometric sensors, and a gateway coupled with the signal monitor, the gateway receiving the biometric information from the signal monitor and providing the biometric information to an external computer system.

Bio-sensing integrated garment

Embodiments of the disclosure provide systems and methods for wearable dry electrodes for collecting biometric information. According to one embodiment, a dry electrode bio-sensor can comprise one or more conductive pads comprising electrodes of the dry electrode bio-sensor and one or more connectivity traces coupled with each of the one or more conductive pads. The connectivity traces can provide electrical connections for one or more of power to the one or more conductive pads or signals comprising biometric information from the one or more conductive pads. A backing can be coupled with and can retain the one or more conductive pads and the one or more connectivity traces. The dry electrode bio-sensor can comprise an electrocardiography (ECG) sensor, a respiration sensor, a PhotoPlethysmoGram (PPG) sensor, a temperature sensor, an electromyography (EMG) sensor, or another biometric sensor.

Garment integrated dry electrode for vital signal and electromyography sensing

An interconnect component is configured as an adapter or interposer providing mechanical and electrical interconnects between conductive threads, such as those woven within fabrics, and electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or a rigid-flex circuit board.

Micro conductive thread interconnect component to make an interconnect between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits

A circuit board transmission line structures has microstrip or stripline transmission line geometries and cross-hatch patterned return planes. The cross-hatch design structure of the return planes and the relative position of the cross-hatch pattern to the transmission lines are configured to increase the usable bandwidth of the transmission lines. By properly adjusting the size and shape of the cross-hatch pattern, the performance of the microstrip and stripline transmission lines can be largely restored to the performance where continuous, solid return planes are used.

Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern

A mechanical strain reduction system include a flexible circuit section of a printed circuit board configured with a meandering shape while in a static state, and a compressible material having a cavity such that the meandering flexible circuit section is positioned within the cavity while the flexible circuit section is in the static state. The flexible circuit section can be part of a rigid-flexible printed circuit board or a flexible printed circuit board. The cavity can be shaped with the same meandering shape as the flexible circuit section in the static state. In general, the cavity is sufficiently shaped to allow positioning of the meandering flexible circuit section within the cavity. Support structures of the same, or different, compressible material can be interspersed within the meander of the flexible circuit section.

Mechanical strain reduction on flexible and rigid-flexible circuits

The luggage lighting system includes a piece of luggage and a lighting module coupled to the luggage. In some embodiments, the lighting module is a fiber-optic lighting module. The luggage includes an outer surface, and the lighting module includes a light diffuser coupled to the outer surface. In some embodiments, the light diffuser is a fiber-optic light diffuser. The lighting module also includes a light source, such as a laser or a light emitting diode (LED). When the light source is powered on, the output light is directed through the light diffuser. The light diffuser is configured to output single or multiple colors of light, easily observed by someone looking at the luggage. The luggage lighting system is particularly useful for identifying one's luggage from surrounding pieces of luggage lacking the luggage lighting system.

Diffuse fiber optic lighting for luggage

A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flexible circuit in order to minimize, reduce, if not preventing cracking and ripping of the circuit as it is bent and flexed. The rip stop transition layer can be placed at different locations on and within the flexible circuit in order to minimize cracking and ripping as the flexible circuit is bent, flexed and twisted.

Rip stop on flex and rigid flex circuits

An electrically interconnected assembly is a technology enabler for mechanical and electrical interconnects between conductive threads, such as those within fabrics and textiles, to electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or rigid-flexible circuit board. The electrically interconnected assembly uses an anisotropic conductive coated fabric to make an electrical and mechanical interconnect in fabrics or textiles. All fabrics or textiles can be anisotropic conductive coated and cut into sheet form or supplied in roll form.

Mechanical and electrical interconnects between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits

A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.

Nano-copper via fill for enhanced thermal conductivity of plated through-hole via

In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, a flexible section of the printed circuit board is configured to have a non-linear portion that functions as a hinge when the flexible section is bent, flexed, twisted or otherwise subjected to a motion related force. The hinge configuration improves durability and flexibility while minimizing ripping and cracking of the printed circuit board, particularly interconnects within the flexible section and a transition region between the flexible section and a rigid section of the printed circuit board. The hinge is configured to have a non-linear shape, such as a serpentine or circuitous path that can include curved portions, different linear portions or some combination of curved and linear portions.

Flexible printed circuit board hinge

A flexible circuit board includes a center 'rigid' section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.

Flexible circuit board and method of fabricating

A stress and/or strain indicator comprises a wearable body, one or more flexible sections, one or more rigid sections and one or more strain gauges. The one or more strain gauges detect a level of stress and/or strain applied to the wearable body in order to indicate when the product is in danger of failing. A warning is activated based upon the level of stress and/or strain applied to the wearable body. For example, the stress and/or strain indicator is able to display a visual and/or an audible warning that a high level of stress and/or strain has been applied to the wearable body and the product is in danger of failing. In some embodiments, the stress and/or strain incident is recorded and downloadable. Consequently, a user is better informed as to when the electronic product is in danger of failing because of damage or misuse.

Wearable electronic stress and strain indicator

In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, multiple small rigid mesas are formed on a flexible printed circuit, where the rigid mesas are physically isolated by trenches formed around their perimeters. Individual electronic components are attached to the multiple rigid mesas. These trenches form openings at which the printed circuit board is enabled to flex, bend or twist, thereby minimizing, if not eliminating, resulting stress applied to the interconnection between the electronic components and the rigid mesas.

Stress relief for rigid components on flexible circuits

A circuit board comprises one or more rigid sections, one or more flexible sections, and one or more transition areas where the circuit board transitions from the rigid section to the flexible section. One or more mechanically restrictive components are applied at a transition area to prevent failure and/or breakage of the circuit as it is bent and flexed. The mechanically restrictive components can be dispersed throughout the circuit as a coverlay, an underlay, and symmetrically positioned within the circuit board as an overlay and an underlay.

Growing community of inventors

Redwood City, CA, United States of America

Mark A Bergman