Robert Boschgmbh

Mariusz Koc

Gary O'Brien

Andrew Graham

Ralf Maier

Ando Lars Feyh

Michael Baus

Bongsang Kim

Michael Schmid

Matthias Marcus Wellhoefer

Nikolaos Gortsas

Steffen Zunft

Bonsang Kim

Ando Feyh

A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.

Micromechanical device having a decoupled micromechanical structure

In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

Robust inertial sensors

A method for examining signals. The method comprises a step of reading in a signal (), a step of comparing the signal () to an interference signal characteristic characterizing an interference signal in order to determine whether the signal () represents the interference signal, and a step of buffering the signal () at least for a predetermined time interval in order to obtain a buffered signal ().

Method and device for examining signals

A combination sensor module for a vehicle, having at least two sensor submodules which are situated in the combination sensor module and able to be connected to the electronics system of the vehicle, wherein the at least two sensor submodules are able to be operated independently of each other.

Flexible combination sensor module for a vehicle

Growing community of inventors

Stuttgart, Germany

Mariusz Koc