Siemens Aktiengesellschaft

Marius Münzinger

Christoph Nöth

Christoph NÖth

In a method for producing a heat sink, a semifinished product of a first metal material is placed into a die and a material layer of a second metal material of a higher thermal conductivity than the first metal material is releasably connected to a pressure surface of a punch. The punch is brought into contact via the material layer with the semifinished product in the die. The heat sink is formed by pressing the first metal material of the semifinished product by the punch through openings of the die fins of the heat sink are formed and into a peripheral rebate of the punch a peripheral side wall of the heat sink, wherein the material layer is connected over its entire surface to the first metal material of the semifinished product. The punch is released from the material layer, and the heat sink is ejected from the die.

Method for producing a heat sink having fins and a peripheral side wall

In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.

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Nuremberg, Germany

Marius Münzinger