Xilinx, Inc.

Marites De La Torre

Donnacha Lowney

Christopher M Gorman

An integrated circuit (IC) can include an analog region of a die of the IC. The analog region includes analog circuitry. The IC further includes a plurality of solder bumps implemented on a surface of the die in an area in vertical alignment with the analog region of the die.

Solder bump arrangements for large area analog circuitry

An apparatus with package integrity monitoring capability, includes: a package having a die connected to an interposer through a plurality of bumps, wherein at least some of the bumps comprise dummy bumps; a package integrity monitor having a transmitter to transmit a test signal and a receiver to receive the test signal; and a first scan chain comprising a plurality of alternating interconnects in the die and in the interposer connecting some of the dummy bumps in series, wherein the first scan chain has a first end coupled to the transmitter of the package integrity monitor and a second end coupled to the receiver of the package integrity monitor.

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Dublin, Ireland

Marites De La Torre