Epcos Ag

Tdk Electronics Ag

Siemens Matsushita Components Gmbh & Co Kg

Marion Ottlinger

Heinz Florian

Martin Galler

Robert Krumphals

Peter Sedlmaier

Adalbert Feltz

Georg Kuegerl

Wolfgang Athenstaedt

Manfred Reinisch

Peter Windisch

Marlene Fritz

Ivan Jagust

Franz Rinner

Reinhard Gabl

Alexander Glazunov

Axel Pecina

Bernhard Döllgast

Harald Kastl

Christoph Auer

Georg Kügerl

Siegfried Fellner

Sigrid Ragossnig

Peter Gerletz

Zeljko Maric

Andreas Stani

Zdravko Mijocevic

Wolfgang Bauer

Franz Aldrian

Markus Weiglhofer

A multi-layered structural element and a method for producing a multi-layered structural element are disclosed. In an embodiment dielectric green sheets, at least one ply containing an auxiliary material which contains at least one copper oxide and layers containing electrode material are provided and arranged alternately one above another. These materials are debindered and sintered. The copper oxide is reduced to form the copper metal and the at least one ply is degraded during debindering and sintering.

Method for producing a multi-layered structural element, and a multi-layered structural element produced according to said method

Methods for producing ceramic multi-layer components and multi-layer components made by such methods. A method includes the following steps: providing green layers for the ceramic multi-layer components, stacking the green layers into a stack and subsequently pressing the stack into a block, singulating the block into partial blocks each having a longitudinal direction, thermally treating the partial blocks and subsequently machining surfaces of the partial blocks. Recesses are produced on the surfaces of the partial blocks during the machining, and the partial blocks are singulated.

Method for producing ceramic multi-layer components

A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

The present invention relates to a method for producing piezoelectric multi-layered components (), which comprises the following steps: applying an electrode material () to green sheets () containing a piezoelectric material, applying a layer of a first auxiliary material () to at least one green sheet () containing the piezoelectric material, forming a stack (), in which the green sheets (), to which electrode material () is applied, are arranged one on top of another, wherein at least one ply of the green sheet (), to which the layer of the first auxiliary material () is applied, is arranged in the stack (), sintering the stack (), wherein the layer of the first auxiliary material () is thinned, and firing the stack (), wherein the stack () is singulated along the at least one ply into at least two multi-layered components ().

Method for producing piezoelectric multi-layered components

A method for manufacturing multilayer components, and a multilayer component are disclosed. The method includes manufacturing a body comprising electrically conductive layers and dielectric layers which are stacked one above the other, wherein the body comprises at least one cavity and at least partially filling the cavity with an insulation material using capillary forces. The method further includes after partially filling the cavity, singulating the body into at least two base bodies and applying a passivation layer to surfaces of the singulated base bodies, wherein the passivation layer comprises a material which is different from the insulation material.

Method for manufacturing multilayer components, and multilayer component

A multi-layer component () is specified, comprising a main body () with an external contact () arranged thereon, a further contact () for electrically contacting the multi-layer component (), and a connecting element () for connecting the external contact () and the further contact (), wherein the connecting element () is embodied in such a way that a decoupling of mechanical stresses that occur in the further contact () from the external contact () is brought about.

Multi-layer component having an external contact

Provision is made of a method for producing a piezoelectric multilayer component (), in which piezoelectric green sheets, at least one ply () containing an auxiliary material having a first and a second component and layers () containing electrode material are arranged one above another alternately and sintered, wherein, during the sintering, the first and second components of the auxiliary material chemically react, and the at least one ply () containing the auxiliary material is degraded. In addition, provision is made of a piezoelectric multilayer component () comprising a plurality of alternating layers of electrode material () and piezoelectric ceramic and at least one layer () of auxiliary material having a breaking load which is reduced compared to the other layers of electrode material, wherein, in addition to the first and second components, the auxiliary material comprises a fifth component, which, at the preferred sintering temperatures for the piezoelectric material, in particular at most 1050&#xb0; C., at most has a negligible sintering activity and does not react with the piezoelectric material used. Finally, the use of ZrO, BaTiOor a mixture thereof in the auxiliary material layer of a piezoelectric multilayer component for reducing the breaking stress is described.

Method for producing a piezoelectric multilayer component, piezoelectric multilayer component containing an auxiliary material, and use of an auxiliary material for setting the breaking stress of a piezoelectric multilayer component

A multilayer component includes a main body and an external contact. The external contact has a connection element and a contact layer. The contact layer electrically conductively connects the main body to the connection element. A connection between the main body and the connection element is produced by sintering of the contact layer.

Multilayer component comprising an external contact and method for producing a multilayer component comprising an external contact

A method for producing a ceramic multilayer element is disclosed. In an embodiment the method includes forming a plurality of multilayer segments in a green state, wherein each multilayer segment is formed by pressing together a plurality of ceramic layers in the green state and pressing together the multilayer segments in the green state to form a multilayer element that is in the green state. The method further includes sintering the multilayer element that is in the green state to form a ceramic multilayer element that includes the ceramic layers and electrode layers arranged one on top of another, wherein at least one or more of a temperature at which the multilayer segments are pressed together, a pressing force applied during the pressing of the multilayer segments, and/or a duration of the pressing of the multilayer segments are adjusted.

Method for producing a multilayer element

An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have a different wettability with solder material.

Electrical component and method for establishing contact with an electrical component

Methods for producing a multilayer ceramic component with alternating ceramic layers and internal electrode layers include producing the ceramic layers using a ceramic mass. The methods also include producing the internal electrode layers using a metal paste that contains a portion of a chemically active additive; wherein the chemically active additive reacts chemically with at least one environmental component other than a metal portion of the metal paste.

Ceramic multi-layer component and method for the production thereof

A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization.

Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material

A multilayer ceramic component includes a stack containing ceramic layers and electrode layers interspersed among the ceramic layers. The electrode layers contain copper and define first and second internal electrodes. First and second external contacts are on different sides of the stack. The first and second external contacts contain copper and are substantially perpendicular to the ceramic layers and electrode layers. The first internal electrode is connected to the first external contact and the second internal electrode is connected to the second external contact. The first and second internal electrodes overlap each other at a plane intersecting the stack. In areas adjacent to boundaries between the first and second external contacts and the ceramic layers, the first and second external contacts are not oxidized and material making-up the ceramic layers is not diminished. A bonding strength of the external contacts to the stack exceeds 50 N.

Method for producing a multilayer ceramic component

A multilayer ceramic component includes a stack containing ceramic layers and electrode layers interspersed among the ceramic layers. The electrode layers contain copper and define first and second internal electrodes. First and second external contacts are on different sides of the stack. The first and second external contacts contain copper and are substantially perpendicular to the ceramic layers and electrode layers. The first internal electrode is connected to the first external contact and the second internal electrode is connected to the second external contact. The first and second internal electrodes overlap each other at a plane intersecting the stack. In areas adjacent to boundaries between the first and second external contacts and the ceramic layers, the first and second external contacts are not oxidized and material making-up the ceramic layers is not diminished. A bonding strength of the external contacts to the stack exceeds 50N.

A piezoelectric component includes a stack of ceramic layers and electrode layers between ceramic layers in the stack. The electrode layers contain copper and the ceramic layers contain lead-zirconate-titanate that is doped with Nb. The ceramic layers are made from a material having a composition of PbV(ZrTiNb)O, where &#x2212;0.05&#x2266;x&#x2266;0.05.

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Deutschlandsberg, Austria

Marion Ottlinger