Lam Research Corporation

Mario Stella

Alan John Jensen

Jeffrey J Farber

Eugene Yuexing Zhao

Peter Renteln

Allan M Radman

A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.

Method and apparatus for controlling CMP pad surface finish

A substrate cleaning system incorporating an edge scrubbing roller is disclosed. The system includes a cleaning station having a first brush and a second brush. The second brush is oriented relative to the first brush so as to receive a flat circular substrate therebetween. The first brush and the second brush are configured to simultaneously scrub a first and second surface of the flat circular substrate. The cleaning station also includes a scrubbing roller that is configured to receive an edge of the flat circular substrate. The scrubbing roller has a scrubbing pad for scrubbing a first surface edge of the first surface, a second surface edge of the second surface, and an edge that is not part of either the first or second surface. The edge scrubbing provided by the scrubbing roller advantageously assists in removing edge beading, metal debris, and other particulates that form during fabrication operations, such as metal deposition. In one example, a spray nozzle or multiple nozzles can be directed at the scrubbing roller so as to deliver targeted cleaning fluids that further assist in removing the desired materials from the wafer periphery, whether it be on the top surface edge, the actual edge, or the bottom surface edge.

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Bedlington, United Kingdom

Mario Stella