Intel Corporation

Teraxion Inc.

Mario Pacheco

Deepak Goyal

William H Wang

Marc A Finot

Gershon Perelman

Purushotham Kaushik Muthur Srinath

Jayakumar Gurusamy

Jason Zweiback

Steve Montesanto

Odissei Touzanov

Alexis Mendez

Jacob Woolsey

Embodiments may relate an x-ray filter. The x-ray filter may be configured to be positioned between an x-ray source output and a device under test (DUT) that is to be x-rayed. The x-ray filter may include at least 80% titanium (Ti) by weight. Other embodiments may be described or claimed.

X-ray filter

According to various examples, a method for non-destructive detection of defects in a semiconductor die is described. The method may include positioning an emitter above the semiconductor die. The method may include generating an emitted wave using the emitter that is directed to a focal point on a surface of the die. The method may include generating a reflected wave from the focal point. The focal point may act as a point source reflecting the emitted wave. The method may include positioning a receiver above the die to receive the reflected wave. The method may also include measuring the reflected wave to detect modulations in amplitude in the reflected wave.

Method, device and system for non-destructive detection of defects in a semiconductor die

Techniques and mechanisms for evaluating misalignment of circuit structures. In an embodiment, infrared (IR) radiation is variously focused on different planes of an assembly including an integrated circuit (IC) chip and a substrate that is to be coupled to, or that is coupled to, the IC chip. The cross-sectional planes include respective structures that variously reflect IR radiation. The reflected IR radiation is measured to create images each representing a corresponding cross-section of the assembly. In another embodiment, respective reference features of the images are identified and evaluated to determine whether a misalignment between the reference features satisfies one or more threshold test conditions.

Device, system and method for alignment of an integrated circuit assembly

Generally discussed herein are systems, apparatuses, and methods that can detect a defect in a die. According to an example, a method can include transmitting a first beam of light with a wavelength and optical power configured to produce a reflected beam with at least one milli-Watt of power, linearly polarizing the first beam of light in a specific direction, circularly polarizing the linearly polarized light by a quarter wavelength to create circularly polarized light, directing the circularly polarized light to a device under test, linearly polarizing light reflected off the device under test by a quarter wavelength, or creating an image of the linearly polarized light reflected off the device under test.

Detection of defect in die

A device for attenuating cladding modes in a single mode optical fiber is disclosed. The device comprises two supports, each equipped with spaced apart corrugations. The optical fiber lies transversely across the corrugations and the two supports are clamped together to impart micro-bends to the optical fiber. The resulting micro-bends provide excellent cladding mode attenuation and the spacing of the corrugations and support members can be adjusted so that the core modes are not attenuated.

Attenuation of cladding modes in optical fibers

The present invention is directed to a system and method for tuning an optical fiber Bragg grating by using a circular mechanism which uniformly stretches the fiber along its length while at the same time preserving the minimal size for stretching.

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Tempe, AZ, United States of America

Mario Pacheco