Eastman-kodak Company

Rochester Institute of Technology

Mario Joseph Ciminelli

Dwight John Petruchik

James Edward Vianco, Sr

Eric A Merz

Michael Alan Marcus

Steven J Dietl

Douglas H Pearson

David M Orlicki

Christopher R Morton

Steven L Moore

Stefan Preble

Jeffrey Steidle

Jaime I Waldman

Paul Thomas

James E Vianco, Sr

David Mark Orlicki

A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.

Photonic chip features for fiber attachment

A method of fabricating a mounting substrate forming an ink inlet in a first layer of a first dielectric; forming contact pads on a second layer of a second dielectric; forming a slot through the second layer; forming a window through a third layer of a third dielectric; aligning and laminating the second layer to the first layer such that the ink inlet is aligned with the slot; and aligning and laminating the third layer to the second layer so the contact pads and the slot are exposed through the window; providing a printhead die having: a drop mechanism for ejecting drops; a chamber to contain ink; and adhesively bonding the printhead die to the second layer so that the printhead die is disposed within the window and an inlet feed opening of the printhead die is aligned with the slot through the second layer.

Fabrication of an inkjet printhead mounting substrate

An inkjet printhead includes a printhead die including: a first nozzle array that is configured to be fed with ink by a first ink feed; and a second nozzle array that is configured to be fed with ink by a second ink feed; and a mounting substrate including: a surface to which the printhead die is attached; a first layer including a first ink channel having an opening disposed at the surface; a second layer including a second ink channel having an opening disposed at the surface; and a third layer disposed between the first layer and the second layer, wherein the printhead die is attached to the first layer, the second layer and the third layer, and wherein the first ink channel opening is fluidically connected to the first ink feed, and the second ink channel opening is fluidically connected to the second ink feed.

Inkjet printhead with layered ceramic mounting substrate

An inkjet printhead includes a printhead die including: a mounting substrate on which the printhead die is mounted, the mounting substrate including: a base layer including a hole; an intermediate layer including: a first surface including a plurality of contact pads; a second surface opposite the first surface, the second surface being proximate the base layer; and a slot that is aligned with the hole in the base layer; and a face layer proximate the first surface of the intermediate layer, the face layer including a window, wherein the printhead die is disposed within the window such that an ink feed opening of the printhead die is in fluid communication with the slot in the intermediate layer of the mounting substrate; and a plurality of electrical interconnections connecting bond pads of the printhead die to the plurality of contact pads on the intermediate layer of the mounting substrate.

Inkjet printhead with multi-layer mounting substrate

A flexible printed wiring member includes a flexible insulating base layer; a patterned copper layer disposed on the insulating base layer, the patterned copper layer including: a first portion including unplated copper leads; and a second portion including a plated metal layer disposed on the patterned copper layer; a first insulating cover layer disposed over the unplated copper leads in the first portion, the first insulating cover layer terminating at a first edge located proximate a boundary between the first portion and the second portion of the patterned copper layer; and a second insulating cover layer disposed over the first insulating cover layer, the second insulating cover layer terminating at a second edge located within the second portion of the patterned copper layer.

Corrosion protected flexible printed wiring member

A liquid ejector includes an electrically insulating support having a first surface and a second surface. An electrical trace begins on the first surface of the support and ends on the second surface of the support. An ejector die is positioned on the first surface of the support and electrically connected to the portion of the electrical trace located on the first surface of the support. A polymer material is molded on a portion of the ejector die and at least a portion of the first surface of the support. A portion of the electrical trace remains free of the polymer material.

Metalized printhead substrate overmolded with plastic

A method of assembling an inkjet printhead comprising providing a printhead chassis; providing a support surface; affixing a printhead die to a die location portion of the support surface; affixing a portion of an attachment surface of a flexible circuit to the support surface adjacent to the die location portion of the support surface; electrically connecting the printhead die to the flexible circuit; affixing a spacer member to a surface of the flexible circuit that is opposite the attachment surface; applying an encapsulating material in contact with the printhead die, the flexible circuit, and the spacer member; and curing the encapsulating material.

Method of protecting printhead die face

A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.

Die mounting assembly formed of dissimilar materials

A marking assembly includes a substrate and a marking device. The substrate includes a first portion made from a first material including a plurality of alignment features, and a second portion made from a second material affixed to the first portion of the substrate. The marking device is affixed to the second portion of the substrate and aligned to the alignment features of the first portion of the substrate.

Insert molded printhead substrate

The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.

Fluid ejection assembly having a mounting substrate

A printhead has a substrate with a mounting surface for a printhead die. The printhead die includes a first face bonded to the mounting surface of the substrate and a second face opposite the first face. The second face including at least one array of marking elements disposed along a marking element array direction. An edge of the printhead die is substantially parallel to the marking element array direction. An inclined surface is positioned proximate to, but not overlapping the edge of the printhead die, wherein a distance from the inclined surface to the mounting surface of the substrate at a first location is greater than a distance from the inclined surface to the mounting surface of the substrate at a second location, the first location also being nearer the edge of the printhead die that is substantially parallel to the marking element array direction than the second location.

Inclined feature to protect printhead face

A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.

Fluid-ejecting device with simplified connectivity

A low temperature method for producing a substantially flat large area image sensor assembly, the method includes the steps of providing a die attach substrate having a substantially planar surface; providing a lead frame having a bonding surface and a plurality of leads extending there from; adhering an imager die to the substantially planar surface of the die attach substrate with a low curing temperature first adhesive; and adhering the die attach substrate with adhered imager die to a bonding surface of the lead frame with a low curing temperature second adhesive for producing an image sensor assembly.

Growing community of inventors

Rochester, NY, United States of America

Mario Joseph Ciminelli