US Government as Represented by the Secretary of the Army

Mario E DeAngelis

John Anthony Dispenza

Nien-Hua Chao

Patrick Calella

Douglas Troast

A non-lethal projectile comprises a carrier with a deployable payload to allow for effective performance at both long and short ranges. The non-lethal projectile is fired from a launcher. At a predetermined range, the carrier opens thereby deploying the payload. The payload may further comprise a drogue chute to reduce the kinetic energy of the payload to a non-lethal level. Alternatively, the inherent drag coefficient of the payload may enable sufficient reduction of kinetic energy without the need for a drogue chute. The deployed petals of the carrier serve as drag surfaces for the carrier, thereby reducing the kinetic energy of the carrier to a non-lethal level.

Variable range terminal kinetic energy limiting non-lethal projectile

A protective layering process that encapsulates and protects printed circuit board assemblies with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold, which are derived from modified data from a 3 dimensional scan of the printed circuit board assembly, and which applies close-forming, encapsulating polymer layers, electrically non-conductive layers, EMI shielding layers, and/or thermal management layers to the electronic components and circuit board assemblies. Polymer layers and protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets/layers can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and from internal and external EMI and to manage thermal dissipation. Multiple, nesting layers, each with different protective properties, can be formed and applied.

Protective layering process for circuit board EMI sheilding and thermal management

A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces.

Protective layering process for circuit boards

A method for internal laser welding of metallized optical components for attachment of optical fibers which comprises the steps of: milling a 'V' groove in one end face of a fiber carrier; aligning an optical fiber in the 'V' groove; polishing end faces of an integrated optics chip and the fiber carrier assembly; depositing chromium layers on integrated optics chip and the fiber carrier assembly; depositing eutectic alloy on chromium layers; optically aligning the optical fiber and a wave guide in the integrated optics chip; and applying a pulse laser beam for an internal laser weld between the end face of the integrated optics chip and the end face of the fiber carrier assembly.

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Ringoes, NJ, United States of America

Mario E DeAngelis