Verteq, Inc.

Akrion Technologies, Inc.

Akrion Systems, LLC

Other

Goldfinger Technologies, LLC

Verteg, Inc.

Interuniversitair Microelektronica Centrum (imec)

Mario E Bran

Michael B Olesen

Yi Wu

Paul Mertens

Raoul Standt

Jeffrey M Lauerhaas

Chad M Hosack

Paul Patel

Geert Doumen

A method for manufacturing integrated circuit devices. In one aspect, the invention may be a method of manufacturing integrated circuit devices comprising: supporting a semiconductor wafer in a substantially horizontal orientation; providing a transducer assembly comprising a probe having a forward portion, a rear portion and no more than one piezoelectric transducer element coupled to the rear portion; supporting the transducer assembly so that the forward portion is adjacent but spaced from a first surface of the semiconductor wafer; rotating the semiconductor wafer; applying a fluid to the first surface of the semiconductor wafer to form a film of the fluid between a portion of the forward portion and the first surface of the semiconductor wafer; and transmitting acoustical energy generated by the piezoelectric transducer element into the film of the fluid via the forward portion, the acoustical energy loosening particles from the first surface of the semiconductor wafer.

Method of manufacturing integrated circuit devices

A method for megasonic processing of an article. In one aspect, the invention may be a method of processing semiconductor wafers comprising: supporting the semiconductor wafer substantially horizontally; positioning a rod-like probe above an upper surface of the semiconductor wafer in an orientation other than normal to the upper surface of the substrate; applying a fluid to the upper surface of the semiconductor wafer so that a film of the fluid is formed between at least a portion of the rod-like probe and the upper surface of the semiconductor wafer; and vibrating the rod-like probe to transmit energy to the upper surface of the semiconductor wafer via the film of the fluid to loosen particles on the upper surface of the semiconductor wafer.

Method for megasonic processing of an article

A method of cleaning a substrate without causing damage to the substrate is provided. The method comprises the steps of providing a transmitter made of a material that is a good conductor of megasonic energy, positioning the transmitter so that a lower edge is positioned spaced from but closely adjacent to a substantially flat surface of the substrate so that when liquid is applied to the edge and the substrate, a meniscus of liquid is formed between the edge and the substrate, providing a transducer for producing megasonic vibration, coupling the transducer to the transmitter so that a transmission path is created to transmit the megasonic vibration into the transmitter, and creating a barrier in the transmission path so that the liquid vibration is attenuated directly beneath the lower edge of the transmitter.

Method of cleaning substrates utilizing megasonic energy

A system for megasonic processing of an article. In one aspect, the system for megasonic processing comprises a rotary support for supporting an article, a dispenser for applying a fluid to a surface of an article positioned on the rotary support; and a transducer assembly. The transducer assembly comprises (i) a transmitter positioned adjacent to the article on the rotary support so that when the fluid is applied to the surface of the article via the dispenser, a meniscus of the fluid is formed between a portion of the transmitter and the surface of the article and (ii) not more than one transducer coupled to the transmitter, the transducer adapted to oscillate at a frequency for propagating megasonic energy through the transmitter and into the meniscus of the fluid.

System for megasonic processing of an article

A megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate is provided. The apparatus includes a megasonic probe, a transducer configured to energize the probe, and a heat transfer element disposed between the transducer and the probe. The heat transfer element may be configured to direct the sonic energy from the transducer toward specific areas of the probe so as to reduce the effect of normal-incident waves relative to shallow-angle waves. Alternatively, a rear end face of the probe may be configured for this purpose. Another embodiment provides a coupler disposed between the heat transfer element and the rear end face of the probe for directing the sonic energy from the transducer toward specific areas of the probe.

Megasonic probe energy director

A transducer assembly for the megasonic processing of an article and apparatus incorporating the same. The transducer assembly comprises a vibration transmitter having a portion configured to be positioned adjacent to and spaced from the surface of an article so that when fluid is applied to the surface of the article, a meniscus of the fluid forms between the surface of the article and the portion of the vibration transmitter. The transducer assembly also comprises a transducer coupled to the vibration transmitter, where the transducer can oscillate to propagate megasonic energy through the vibration transmitter and through the meniscus of the fluid. In one embodiment, the transducer is located within an enclosed space and at least one passageway is provided for flowing a gas in and/or out of the enclosed space. In an another embodiment, the portion of the vibration transmitter includes an elongated edge that is positioned close to and generally parallel to a surface of the article. In an apparatus incorporating the transducer assembly, a rotatable support is provided to support the article to be processed.

Transducer assembly for megasonic processing of an article and apparatus utilizing the same

A transducer assembly used for the megasonic processing of an article. In one aspect, the transducer assembly comprises: a vibration transmitter having a rear portion adapted to be supported adjacent to an article to be processed and having an elongated forward portion adapted to extend close to a surface of the article so that when a fluid is applied to the surface of the article, a meniscus of the fluid is formed between the elongated forward portion and the surface of the article; and a transducer coupled to the rear portion of the transmitter, the transducer adapted to oscillate at a frequency for propagating megasonic energy through the elongated forward portion of the transmitter and into the meniscus of the fluid. In one embodiment, the transducer assembly can further comprise a housing with at least one opening for flowing a gas into a space in the housing in contact with the transducer.

Apparatus for megasonic processing of an article

A method of cleaning a substrate comprises placing the substrate on a rotating fixture, placing a liquid on at least one side of the substrate, and creating a standing wave of megasonic energy oriented generally parallel to the substrate. The standing wave generates an associated pattern of high-agitation regions in the liquid. The method further comprises moving the standing wave back-and-forth so as to move the pattern of high-agitation regions about with respect to the substrate. An apparatus for cleaning substrates comprises a support to rotate the substrate about a first axis, and a transmitter extending generally parallel to a surface of the substrate. The apparatus further comprises a megasonic transducer in acoustically coupled relation to the transmitter, and a reciprocation drive in fixed relation to the transmitter. The reciprocation drive moves the transmitter back-and-forth within a plane generally parallel to the surface of the substrate.

Reciprocating megasonic probe

A method of processing thin flat articles, particularly semiconductor wafers, utilizing sonic energy. In one aspect, the invention is a method comprising: supporting a substrate in a generally horizontal orientation and transmitting sonic energy to the substrate while flowing liquid onto both sides of the substrate to loosen particles on both sides of the substrate while maintaining said orientation. In another aspect, the invention is a cleaning method comprising: applying cleaning fluid to one side of a thin flat article while supporting the article in a generally horizontal orientation; and applying energy to the other one of the sides with sufficient power to produce vibration on the one side in the area of the cleaning fluid to loosen particles on the one side, while maintaining said orientation.

Method of cleaning a side of a thin flat substrate by applying sonic energy to the opposite side of the substrate

An apparatus includes a rotatable chuck for supporting a substrate and a splash guard. The splash guard surrounds the chuck and surrounds a substrate mounted on the chuck. The splash guard has a portion that deflects fluid being flung off the substrate by centrifugal action in a manner so as to not splash back onto the substrate. The splash guard is moveable between a process position in which the upper annular edge of the splash guard extends above the chuck and a substrate on the chuck, and a load/unload position in which the splash guard is tilted so that one side of the upper annular edge is below an upper edge of the chuck. The movement of the splash guard facilitates loading and unloading of a substrate.

Megasonic cleaner and dryer system

The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.

Apparatus and methods for reducing damage to substrates during megasonic cleaning processes

Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe. In one arrangement, fluid is sprayed onto both sides of a wafer while a probe is positioned close to an upper side. In another arrangement, a short probe is positioned with its end face close to the surface of a wafer, and the probe is moved over the wafer as it rotates. The probe may also be positioned through a central hole in a plurality of discs to clean a group of such elements at one time.

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Garden Grove, CA, United States of America

Mario E Bran