Infineon Technologies Austria Ag

Infineon Technologies Ag

Mario Barusic

Anton Mauder

Gerhard Schmidt

Matteo Dainese

Markus Beninger-Bina

Werner Schustereder

Evelyn Napetschnig

Markus Bina

Oliver Humbel

Benedikt Stoib

Josef Georg Bauer

Georg Schinner

Robert Hartl

Hans Millonig

Sandra Wirtitsch

Aleksander Hinz

A power diode includes a semiconductor body having an anode region and a drift region, the semiconductor body being coupled to an anode metallization of the power diode and to a cathode metallization of the power diode, and an anode contact zone and an anode damage zone, both implemented in the anode region, the anode contact zone being arranged in contact with the anode metallization, and the anode damage zone being arranged in contact with and below the anode contact zone, wherein fluorine is included within each of the anode contact zone and the anode damage zone at a fluorine concentration of at least 1016 atoms*cm-3.

Power diode and method of manufacturing a power diode

A method of processing a power diode includes: creating an anode region and a drift region in a semiconductor body; and forming, by a single ion implantation processing step, each of an anode contact zone and an anode damage zone in the anode region. Power diodes manufactured by the method are also described.

A power diode includes a semiconductor body coupled to an anode metallization and to a cathode metallization. The semiconductor body has a drift region of a first conductivity type and an anode region of a second conductivity type. The anode region includes: a contact zone arranged in contact with the anode metallization; a field stop zone arranged below the contact zone; and a body zone arranged below the field stop zone and above the drift region. An electrically activated dopant concentration of the anode region has a profile, along a vertical direction, according to which: a first maximum is present within the contact zone; a second maximum is present within the field stop zone; and the dopant concentration continuously decreases from the first maximum to a local minimum, and continuously increases from the local minimum to the second maximum.

Power diode

A method of processing a power diode includes: creating an anode region and a drift region in a semiconductor body: and forming, by a single ion implantation processing step, each of an anode contact zone and an anode damage zone in the anode region. Power diodes manufactured by the method are also described.

A method for forming a semiconductor device includes incorporating recombination center atoms into a semiconductor substrate. The method further includes, after incorporating the recombination center atoms into the semiconductor substrate, implanting noble gas atoms into a doping region of a diode structure and/or a transistor structure, the doping region being arranged at a surface of the semiconductor substrate.

Semiconductor device and method for forming a semiconductor device

According to various embodiments, a method for processing a semiconductor region, wherein the semiconductor region comprises at least one precipitate, may include: forming a precipitate removal layer over the semiconductor region, wherein the precipitate removal layer may define an absorption temperature at which a chemical solubility of a constituent of the at least one precipitate is greater in the precipitate removal layer than in the semiconductor region; and heating the at least one precipitate above the absorption temperature.

Method for processing a semiconductor region and an electronic device

Disclosed are a method and a semiconductor device. The method includes implanting recombination center atoms via a first surface into a semiconductor body, and causing the implanted recombination center atoms to diffuse in the semiconductor body in a first diffusion process.

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Seebogen, Austria

Mario Barusic