Growing community of inventors

Catania, Italy

Mario Antonio Aleo

Average Co-Inventor Count = 2.89

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 0

Mario Antonio AleoGiovanni Conti (5 patents)Mario Antonio AleoGaetano L'Episcopo (5 patents)Mario Antonio AleoDavide Giuseppe Patti (3 patents)Mario Antonio AleoCarmelo Occhipinti (3 patents)Mario Antonio AleoEnrico Rosario Alessi (1 patent)Mario Antonio AleoKarel Blaha (1 patent)Mario Antonio AleoJonathan Steckel (1 patent)Mario Antonio AleoPavel Vicek (1 patent)Mario Antonio AleoMario Antonio Aleo (9 patents)Giovanni ContiGiovanni Conti (8 patents)Gaetano L'EpiscopoGaetano L'Episcopo (7 patents)Davide Giuseppe PattiDavide Giuseppe Patti (66 patents)Carmelo OcchipintiCarmelo Occhipinti (3 patents)Enrico Rosario AlessiEnrico Rosario Alessi (47 patents)Karel BlahaKarel Blaha (3 patents)Jonathan SteckelJonathan Steckel (2 patents)Pavel VicekPavel Vicek (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Stmicroelectronics S.r.l. (10 from 5,576 patents)

2. Stmicroelectronics (Grenoble 2) Sas (1 from 619 patents)


9 patents:

1. 12293729 - Optoelectronic device

2. 11978411 - System architecture for high density mini/micro LED backlight application

3. 11948927 - Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die

4. 11831793 - Methods and devices for authentication

5. 11710450 - Method for hybrid pulse amplitude and width modulation in LED drivers for display panels

6. 11631376 - System architecture for high density mini/micro LED backlight application

7. 11569211 - Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die

8. 11545082 - Method for hybrid pulse amplitude and width modulation in led drivers for display panels

9. 11063027 - Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
1/10/2026
Loading…