Micronit Microfluidics B.v.

Universiteit Leiden

Micronit Microtechnologies B.v.

Marinus Bernardus Olde Riekerink

Marko Theodoor Blom

Ronny Van 't Oever

Johannes Oonk

Elwin Xander Vrouwe

Amitava Gupta

Jean-Christophe Roulet

Jean-Noël Fehr

Ronny Van't Oever

Jeroen Haneveld

Michael Keith Richardson

Peter Tijssen

Wilfred Buesink

Manjeet Dhindsa

Arenda Hendrika Jacoba Koelewijn-Hubers

Hendrik Jan Hildebrand Tigelaar

Eric Marijn Wielhouwer

Ronny Van 'T Oever

Arenda Hendrika Jacoba Koelwijn-Hubers

The invention relates to a device (), comprising:

Device and method for activating a capillary-stop valve of a device

The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply. The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.

Method for manufacturing microfluidic chips, device for functionalizing microfluidic chips, microfluidic chip and device for holding a microfluidic chip

The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Method of bonding two substrates and device manufactured thereby

A biological microfluidics chip comprising a substrate, a microfluidic inlet port defining an opening in a surface of the substrate, and a microfluidic outlet port defining an opening in a surface of the substrate. The biological microfluidics chip also comprises a plurality of wells extending from a top surface of the substrate, wherein each well is bounded by one or more walls, and an inlet opening and an outlet opening are provided in a wall of each of the plurality of wells. An inlet microfluidic channel is provided in the substrate to connect the microfluidic inlet port to each of the inlet openings in the walls of the wells, and an outlet microfluidic channel is provided in the substrate to connect each of the outlet openings in the walls of the wells to the microfluidic outlet port.

Biological microfluidics chip and related methods

Growing community of inventors

Losser, Netherlands

Marinus Bernardus Olde Riekerink