Stmicroelectronics (grenoble 2) Sas

Marika Sorrieul

Karine Saxod

A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring

Method for fabricating an electronic device and a stacked electronic device

A support plate has a front face with an electronic chip mounted on the front face. A cover for encapsulating the electronic chip includes a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate. The support plate and the encapsulating cover define a chamber in which the electronic chip is located. A local slot is arranged to extend between the peripheral wall of the encapsulating cover and the support plate. The local slot has an exterior opening and an interior opening leading into said chamber.

Electronic package with a local slot forming an air-vent

A method for fabricating an electronic device, and an electronic device in a stacked configuration, includes a rear face of an integrated-circuit chip that is fixed to a front face of a support wafer. A protective wafer is located facing and at a distance from the front face of the chip, and an infused adhesive is interposed between the chip and the protective wafer and located on a zone of the front face of the chip outside a central region of this front face. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. An obstruction barrier is arranged between the chip and the protective wafer and is disposed outside the central region of the front face of the chip. An encapsulation ring surrounds the chip, the protective wafer and the obstruction barrier.

Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive

An integrated circuit chip is mounted on top of a base wafer, and a protection wafer is mounted on top of the integrated circuit chip. An encapsulation block is formed around the integrated circuit chip and the protection wafer and on a peripheral part of the front face of the base wafer. The encapsulation block includes a first encapsulation ring arranged around the integrated circuit chip and the protection wafer, having an annular beading protruding with respect to the front face of the protection wafer and forming a peripheral groove () recessed with respect to this protruding annular beading. A second encapsulation ring of the encapsulation block fills the peripheral groove of the first encapsulation ring.

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Montaud, France

Marika Sorrieul