Texas Instruments Corporation

Marie-Solange Anne Milleron

Matthew David Romig

Gregory Eric Howard

Benjamin Michael Sutton

Souvik Mukherjee

A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.

Integrated circuit package and method

A semiconductor chip () with bond pads () on a substrate () with rows and columns of regularly pitched metal contact pads (). A zone comprises a first pair () and a parallel second pair () of contact pads, and a single contact pad () for ground potential; staggered pairs of stitch pads () connected to respective pairs of adjacent contact pads by parallel and equal-length traces (, etc.). Parallel and equal-length bonding wires (, etc.) connect bond pad pairs to stitch pad pairs, forming differential pairs of parallel and equal-length conductor lines. Two differential pairs in parallel and symmetrical position form a transmitter/receiver cell for conducting high-frequency signals.

Growing community of inventors

Paris, France

Marie-Solange Anne Milleron