International Business Machines Corporation

Marie S Cole

Jacob T Porter

Suraush Q Khambati

Michael R Kane

Colin Edward Masterson

John Ulrich Knickerbocker

Mukta G Farooq

William E Bernier

Tasha E Lopez

David J Welsh

John Anthony Fitzsimmons

Roger Allan Quon

Lewis Sigmund Goldmann

Tien-Jen Cheng

Anson Jay Call

Karl G Hoebener

David E Eichstadt

John R Behun

Francis F Cappo

John C Milliken

Bruno T Klingel

Brian Robert Prasky

Eric Vance Kline

Harsaran S Bhatia

Jason Lee Frankel

Paul Robert Walling

Michael S Cranmer

James Philip O'Connor

Douglas Alexander Smalley

Kenneth A Papae

Sierra R F Spring

An apparatus for deployment and retrieval of section dividers includes a frame, a deployment rail, a first section divider carrier rail, and a second section divider carrier rail. The structure includes a first end of the first section divider carrier rail coupled to a first end of the deployment rail and a first end of the second section divider carrier rail coupled to a second of the deployment rail. A first actuator coupled to the first end of the first section divider carrier rail. A second actuator coupled to the second end of the first section divider carrier rail. The structure further includes a first deployment and retrieval system coupled to the first section divider carrier rail, wherein the first deployment and retrieval system guides a first retrieval body at a first end of a first section divider from the deployment rail to the first section divider carrier rail.

Deployable and retrievable section dividers

A rotor assembly is provided and includes a rotor, tongs and an actuation system. The rotor includes a shaft defining a rotational axis about which the rotor is rotatable and rotor elements supported on the shaft to define grooves. The tongs are disposed in the grooves to occupy and move between first and second positions. At the first positions, the tongs are retracted from the grooves. At the second positions, the tongs are engaged in the grooves to disentangle fibers from the rotor. The actuation system is configured to bias the tongs toward the first positions and is actuatable to drive the tongs into the second positions.

Apparatus for disentanglement of fibers from rotors

Devices and processes for axial disentanglement of debris from a rotatable mechanical agitator generally includes a cleaning member including a top stem portion, an intermediate cutting portion, and a bottom base portion; and a cylindrically-shaped mechanical agitator rotatably mounted within a head unit. The mechanical agitator includes one or more channels extending along a longitudinal axis and the head unit includes a slot opening coaxially aligned with a channel when in use. The bottom base portion and the intermediate cutting portion are configured to traverse a length of the one or more channels, wherein the intermediate cutting portion is positioned to cut debris entangled on the mechanical agitator when the top stem portion slidingly engages the slot opening in the head unit.

Apparatus for axial disentanglement of debris from a mechanical agitator

An interlocking device for monitoring and enforcing shipping and acclimation conditions includes a servo motor, at least one locking pin, a battery, and a printed circuit board disposed within an enclosure, where the battery is electrically coupled to the servo motor and the printed circuit board. The interlocking device further includes a housing of an input power connector insertable into a first end of the enclosure to prevent the housing of the input power connector from electrically coupling to a power source, where the servo motor is configurable to engage the at least one locking pin to prevent a removal of the housing of the input power connector while inserted in the first end of the enclosure. The interlocking device further includes the printed circuit board configured to control the servo motor based on readings from one or more sensors electrically coupled to the printed circuit board.

Interlocking device for shipment monitoring and acclimation

Adjustable fastener tools are provided for engaging socket heads. The tool includes a support member, multiple engagement fingers, and an adjustment mechanism. The support member has multiple radially-extending tracks, and a central opening, and the fingers are associated with, and slidable along, the radially-extending tracks. The fingers include at radially inner ends jaws with respective contact surfaces for engaging the socket head. The adjustment mechanism resides, at least in part, within the central opening in the support member, and couples to the fingers. The adjustment mechanism includes an actuating member and multiple hinged trusses. A hinged truss of the trusses is hingedly coupled at one end to the actuating member and hingedly coupled at an other end to a respective finger of the engagement fingers. Movement of the actuating member results, via the hinged truss, in slidable movement of the respective finger along its associated radially-extending track.

Adjustable fastener tools for engaging socket heads

Examples of techniques for constructing a spatial map of a physical space are disclosed. In one example implementation according to aspects of the present disclosure, a computer-implemented method includes collecting, by a processing device, signal strength data about a plurality of user devices as the plurality of user devices move throughout the physical space, the signal strength data being indicative of a signal strength of a wireless signal between at least one of the plurality of user devices and at least one of a plurality of access points associated with the physical space. The method further includes generating, by the processing device, a signal space map based at least in part on the signal strength data. The method further includes transforming, by the processing device, the signal space map of the physical space into the spatial map of the physical space to construct the spatial map of the physical space.

Constructing a map of a physical space

Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.

Compressible films surrounding solder connectors

Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Low stress conductive polymer bump

A structure for a system of chip packages includes a master substrate and at least one subset substrate of the master substrate. The subset substrate includes a portion of the master substrate that has an identical pin out pattern as the portion of the master substrate. The subset substrate has identical internal net lists as the portion of the master substrate. The subset substrate is adapted to accommodate a smaller chip than the master substrate. The master substrate is the largest substrate in the system. The invention also prepares a system of chip packages. The invention selects a master substrate and then selects a subset substrate of the master substrate.

Nested design approach

Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.

Interconnection structure and test method

Growing community of inventors

Wappingers Falls, NY, United States of America

Marie S Cole