Sws Silicones Corporation

Marie J Streusand

John C Getson

Richard C McAfee

This invention relates to thermally conductive heat curable organopolysiloxane compositions containing from 30 to 95 percent by weight of filler based on the weight of the composition of which at least 10 percent by weight of the filler is silicon nitride particles.

Thermally conductive heat curable organopolysiloxane compositions

This invention relates to thermally conductive room temperature vulcanizable organopolysiloxane compositions containing hydroxyl-terminated organopolysiloxanes, a crosslinking agent selected from polyalkoxysilanes and polyalkoxysiloxanes, a condensation catalyst and from 30 to 95 percent by weight of filler based on the weight of the composition, of which at least 10 percent by weight of the filler is silicon nitride particles.

Thermally conductive room temperature vulcanizable compositions

Silicone elastomers having thermally conductive properties which comprise an organopolysiloxane having Si-bonded aliphatically unsaturated groups, an organohydrogenpolysiloxane having Si-bonded hydrogen atoms, a catalyst capable of promoting the addition of Si-bonded hydrogen to Si-bonded aliphatically unsaturated groups and from about 30 to 95 percent by weight of filler, based on the weight of the composition, of which at least 10 percent by weight of the filler is silicon nitride particles.

Growing community of inventors

Saline, MI, United States of America

Marie J Streusand