General Semiconductor, Inc.

General Semiconductor Ireland

Marie Guillot

Finbarr O'Donoghue

Owen McAuliffe

Paddy O'Shea

Tadhgh O'Brien

A hybrid semiconductor device comprises four identical semiconductor diode chips each having top and bottom surfaces. Each chip is mounted on a respective mounting pad all of which lie in a common plane and, for ease of assembly, the four chips are mounted in identical top to bottom orientation, e.g., bottom surface down and electrically connected to the mounting pads. In one embodiment, the mounting pads for the chips and terminals for the device are integral with leads of a single (&ldquo;component&rdquo;) lead frame and various electrical connectors for the chips comprise bonding wires or stamped metal jumpers added to the workpiece after the chips are mounted on the lead frame. The metal jumpers can be provided on a separate &ldquo;jumper&rdquo; lead frame used in cooperation with the component lead frame, or the jumpers can comprise portions of leads of the single component lead frame. Printed circuit boards embodiments are also disclosed.

Hybrid S.C. devices and method of manufacture thereof

Two phase bridge rectifier, plastic encapsulated devices having four external terminal leads are batch fabricated using a workpiece of three stacked together lead frames wherein, at each of a plurality of device sites on the workpiece, two, two-chip stacks of semiconductor diode chips are provided; each chip of each stack being sandwiched between respective pairs of bonding pads on either top and middle lead frames or middle and bottom lead frames. Each of the two bonding pads of the middle frame is connected to a respective integral terminal lead of the middle frame. An integral extension of a bonding pad of each of the top and bottom lead frames is bent out of the plane of its respective lead frame to include a flat terminal lead portion lying in the plane of the middle frame but not connected thereto. All four in-plane terminal leads include dam bars for use during device encapsulating; the dam bars from the top and bottom lead frames cooperating to form a single, in-plane dam bar. After encapsulation, individual devices are separated from the lead frame workpiece by severing ends of the four terminal leads from their respective lead frames.

Fabrication of hybrid semiconductor devices

A temporary self-adherence of the individual components in a stack of semiconductor components is accomplished by the use of adhesive bodies either separate from the solder preforms used in the stack or included within the solder in the form of a tacky paste. The adhesive bodies may comprise relatively high-purity water, and adhesion of the adjoining parts is achieved by the surface tension of the water. During a single heating step, preferably performed in a protective, non-oxidizing atmosphere, the water is completely evaporated while the solder preforms are heated to form the desired solder joints.

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Cloyne, Ireland

Marie Guillot