International Business Machines Corporation

Marie-France Boyaud

Marie-Claude Paquet

Real Joseph Tetreault

Catherine Dufort

A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting the first and second cavities. The first cavity is adapted to enclose the integrated circuit chip on the substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.

Transfer molding of integrated circuit packages

A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.

There is provided a method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly including an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means, e.g., a clamp, applies a clamping force to the first and the second portions of the mold to clamp the substrate between the first and second portions with the integrated circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.

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Bromont, Canada

Marie-France Boyaud