Thomson-csf

Marianne Boudot

Michel Heitzmann

The invention provides a process for mounting an ultra-high frequency diode so as to form a pre-matched module. The module of the invention comprises a copper base, a quartz ring and a copper cover: these three parts, coated with gold at least on their facing faces, are assembled together by thermocompression. Inside this case, the diode chip, soldered to the base via a gold heat sink is biased by a false 'beam-lead' connection, a metal star whose arms are curved, which reduces the inductance and capacity of this connection with respect to the base. The false 'beam-lead' is formed by metalizing a mesa obtained on a silicon wafer.

Pre-matched module for an ultra-high frequency diode and a process for

A pre-matched module is provided for an ultra-high frequency diode with high heat dissipation, comprising a diode chip biassed by a connection and mounted inside a case formed by a metal base, a quartz ring and a metal cap. The base of the case comprises two fixed and metal-coated diamonds one of which has dimensions very much greater than those of the other central diamond, these two diamonds allowing the heat released by the diode to be removed to a maximum and allowing the cap to provide, because of its dimensions and those of the diamond and of the ring, good radial impedance transformation.

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Clichy, France

Marianne Boudot