Imec

Imec Vzw

Depuy Synthes Products, Inc.

Universiteit Gent

Katholieke Universiteit Leuven, Ku Leuven R&d

Stichting Imec Nederland

Katholieke Universiteit Leuven

Maria Op De Beeck

Eric Beyne

Philippe Soussan

Liesbet Lagae

George A Mikhail

Seulki Lee

Jochen Walser

Bjorn Vandecasteele

Binh Bao Vu

Mark Fichman

Erfan Sheikhi

Sven Cornelissen

Dan Dlugos

Navid Shahriari

Binh Vu

An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.

Implantable sensor electronics packaging

An example embodiment may include a method for placing on a carrier substrate a semiconductor device. The method may include providing a semiconductor substrate comprising a rectangular shaped assist chip, which may include at least one semiconductor device surrounded by a metal-free border. The method may also include dicing the semiconductor substrate to singulate the rectangular shaped assist chip. The method may further include providing a carrier substrate having adhesive thereon. The method may additionally include transferring to and placing on the carrier substrate the rectangular shaped assist chip, thereby contacting the adhesive with the rectangular shaped assist chip at least at a location of the semiconductor device. The method may finally include singulating the semiconductor device, while remaining attached to the carrier substrate by the adhesive, by removing a part of rectangular shaped assist chip other than the semiconductor device.

Method for transferring and placing a semiconductor device on a substrate

A method is disclosed for packaging a device, e.g., for bio-medical applications. In one aspect, the method includes obtaining a component on a substrate and separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate. The method also includes providing an encapsulation for the chip. The resulting packaged chip advantageously has a good step coverage resulting in a good hermeticity, less sharp edges resulting in a reduced risk of damaging or infection after implantation and has a relatively small packaged volume compared to conventional big box packaging techniques.

Biocompatible packaging

A method according to embodiments of the present invention comprises providing a magnetic stack comprising a magnetic layer sub-stack comprising magnetic layers and a bottom conductive electrode and a top conductive electrode electrically connecting the magnetic layer sub-stack at opposite sides thereof; providing a sacrificial pillar on top of the magnetic stack, the sacrificial pillar having an undercut with respect to an overlying second sacrificial material and a sloped foot with increasing cross-sectional dimension towards the magnetic stack, using the sacrificial pillar for patterning the magnetic stack, depositing an insulating layer around the sacrificial pillar, selectively removing the sacrificial pillar, thus creating a contact hole towards the patterned magnetic stack, and filling the contact hole with electrically conductive material.

Patterning of and contacting magnetic layers

Methods and systems are described for improving optical lithographic processing of a substrate by selecting appropriate system parameters in order to obtain a good image or print of the pattern to be obtained in a resist layer, which includes selecting a set of system parameters for an optical lithographic system having selectable system parameters, thus characterising the optical lithographic system and obtaining transferred lens pupil information. The latter is performed by obtaining, for each point of a set of points within a lens pupil of the optical lithographic system with the selected set of system parameters, a value of at least one optical parameter at a level of the substrate, the at least one optical parameter being a property of a light ray projected towards the substrate from the point of the set of points within the lens pupil. The lens pupil information then is combined with information about the mask to be used for generating the pattern in the resist layer. This combined information allows evaluating or ranking the optical lithographic system, defined by the selected set of system parameters, for the lithographic processing to be performed.

Methods and systems for improved optical lithographic processing

In the present invention, a BARC stack comprising at least a first BARC layer and at least a second BARC layer is optimized for reducing substrate reflectivity in lithographic processing applications. The first BARC layer is positioned adjacent the resist layer, while the second BARC layer is positioned adjacent the first BARC layer. The optical parameters of the first BARC layer are determined to be slightly different from the optical parameters of the resist, thus resulting in a small optical step at the interface resist/first BARC. Furthermore, the second BARC may be selected to have optical parameters such that the optical step at the interface first BARC/second BARC is slightly larger but still relatively small compared to the optical step between resist and substrate. The thicknesses for the BARC layers can be determined from substrate reflectivity calculations. The latter allows obtaining a low substrate reflectivity for various pitches in a pattern to be printed.

Method and system for optimizing a BARC stack

Growing community of inventors

Leuven, Belgium

Maria Op De Beeck