The Panda Project

Silicon Bandwidth, Inc.

Other

Quantum Leap Packaging, Inc.

Maria M Portuondo

Stanford W Crane, Jr

Edward V Cruz

Shaun Fynn

Maurice Bizzarri

Willard Erickson

Joseph M Mosley

Vincent R Razo

Barry P Sween

Hunter T Foy

Drew L Taylor

James Allan

A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

Backplane system having high-density electrical connectors

A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts. A semiconductor die carrier may also include an insulative substrate; a plurality of leads each having an external portion extending out of the semiconductor die carrier from a lower surface of the insulative substrate and an internal portion located within the semiconductor die carrier at an upper surface of the insulative substrate; a semiconductor die; and a layer of conductive material in contact with conductive portions of the semiconductor die and also in contact with the internal portions of the leads.

Semiconductor chip carrier affording a high-density external interface

A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.

Prefabricated semiconductor chip carrier

A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts. A semiconductor die carrier may also include an insulative substrate; a plurality of leads each having an external portion extending out of the semiconductor die. carrier from a lower surface of the insulative substrate and an internal portion located within the semiconductor die carrier at an upper surface of the insulative substrate; a semiconductor die; and a layer of conductive material in contact with conductive portions of the semiconductor die and also in contact with the internal portions of the leads.

Semiconductor chip carrier including an interconnect component interface

Computer system having a modular architecture

A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads extends from at least one of the side surfaces of the insulative package. Each of the leads has a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board such that, when the distal ends of the leads are secured to the printed circuit board, at least a portion of the insulative package is located below an upper surface of the printed circuit board.

Low profile semiconductor die carrier

Method of manufacturing a semiconductor chip carrier

A computer system includes a first passive backplane having a local bus, a memory bus, and peripheral bus. The computer system includes a first printed circuit board having a microprocessor, and connected to the local bus and to the memory bus. The computer system includes a second printed circuit board having a memory and connected to the memory bus. The computer system also includes a third printed circuit board having a peripheral controller, and connected to the local bus and to the peripheral bus The disclosed computer system further includes a second backplane. The second backplane is connected to the first passive backplane through a connector, where at least one of the local and peripheral buses extends from the first passive backplane to the second backplane through the connector. The computer system also includes a plurality of peripheral slots located on the second backplane and connected to the peripheral bus.

Passive backplane capable of being configured to a variable data path

A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads.

Semiconductor die carrier having a dielectric epoxy between adjacent

Computer having a high density connector system

An electrically conductive contact beam for use in an electrical interconnect component. The contact beam includes a stabilizing section for securing the contact beam within a support substrate, and a contact section, connected to the stabilizing section, for establishing contact between the contact beam and an electrically conductive contact from another electrical interconnect component. The contact section includes a merge radius section connecting the contact section to the stabilizing section, a flexible section connected to the merge radius section and having an elongated curvature, a contact area, disposed at an end of the curvature opposite the merge radius section, for contacting the conductive contact from the other electrical interconnect component, and a lead-in section, connected to the contact area, for initiating deflection of the contact section upon contact of the lead-in section with a portion of the other electrical interconnect component.

Growing community of inventors

Boca Raton, FL, United States of America

Maria M Portuondo