U.S. Philips Corporation

Maria H W A Van Deurzen

Ronald Dekker

Henricus G R Maas

A thin film semiconductor device includes a glass supporting body having thereon an insulating substrate which is attached thereto by a layer of adhesive material. On the surface of the substrate facing the supporting body is a layer of semiconductor material which includes therein a semiconductor element, such surface further having thereon a metalization pattern of conductor tracks. An insulating layer is additionally provided between the metalization pattern and the adhesive layer, and has a dielectric constant &egr;,below 3 and a thickness in the range of approximately 20 &mgr;m to 60 &mgr;m. By virtue of such additional layer, parasitic capacitanees between the metalization pattern and an envelope in which the device is included or a printed circuit board on which the device is mounted are reduced substantially, thereby reducing the power consumption of the device.

Semiconductor device comprising a glass supporting body onto which a substrate with semiconductor elements and a metalization is attached by means of an adhesive

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Eindhoven, Netherlands

Maria H W A Van Deurzen