Electro Scientific Industries, Inc.

Xsil Technology Limited

Maria Farsari

Adrian Boyle

David Gillen

Kali Dunne

A die bonding method and apparatus by which a wafer substrateadhered to a carrier tapeby an adhesive layeris laser machined through the wafer substrate and through the adhesive layer at most to scribe the carrier tape to form a singulated diewith an attached singulated adhesive layer, without substantial delamination of the adhesive layerand carrier tapeor substantial production of burrs from the adhesive layer. The carrier tapeis cured, preferably by ultraviolet light, to release the adhesive layer from the carrier tape. The singulated die is picked and placed on a die pad and the adhesive layeris cured, preferably by heat, to adhere the die to the die pad.

Die bonding

A UV laser beam is used to machine semiconductor. The beams intensity (I ) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing I An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_centre), for each value of z-integer in the z direction.

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Heraklion, Greece

Maria Farsari