Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Rohm and Haas Electronics Materials LLC

Shipley Company LLC

Maria Anna Rzeznik

Zukhra I Niazimbetova

Lingli Duan

Zuhra I Niazimbetova

Feng Liu

Weijing Lu

Lei Huang

Chen Chen

Shaoguang Feng

Julia Kozhukh

Tong Sun

Donald E Cleary

Kristen M Milum

Craig S Allen

Lei Zhang

Rajan Hariharan

Martin William Bayes

John P Cahalen

Erik Reddington

Elie H Najjar

Philip D Knudsen

David L Jacques

John E Schemenaur

Yuhsin Tsai

S Matthew Cairns

Xuesong Wang

Zukhra L Niazimbetova

Zuhra L Niazimbetova

Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.

Copper electroplating baths containing reaction products of amines, polyacrylamides and bisepoxoides

Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.

Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones

Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.

Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths

A method of providing spatial diversity for critical data delivery in a beamformed mmWave small cell is proposed. The proposed spatial diversity scheme offers duplicate or incremental data/signal transmission and reception by using multiple different beams for the same source and destination. The proposed spatial diversity scheme can be combined with other diversity schemes in time, frequency, and code, etc. for the same purpose. In addition, the proposed spatial diversity scheme combines the physical-layer resources associated with the beams with other resources of the same or different protocol layers. By spatial signaling repetition to avoid Radio Link Failure (RLF) and Handover Failure (HOF), mobility robustness can be enhanced. Mission-critical and/or time-critical data delivery can also be achieved without relying on retransmission.

Metal plating compositions

Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.

Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides

Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.

Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides

A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.

Copper electroplating baths containing compounds of reaction products of amines and quinones

Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.

Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.

Nitrogen containing polymers as levelers

Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.

Polymers containing benzimidazole moieties as levelers

Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.

Growing community of inventors

Shrewsbury, MA, United States of America

Maria Anna Rzeznik