Nitto-denko Corporation

Other

Mari Tanabe

Hideo Sugawara

Hidehiko Andou

A transparent conductive laminate includes a coating film including a first transparent resin film and a coating layer or layers provided on one or both sides of the first transparent resin film; a transparent conductive film including a second transparent resin film and a transparent conductive layer provided on one side of the second transparent resin film; and a pressure-sensitive adhesive layer interposed between the coating film and the transparent conductive film, wherein the coating layer of the coating film is laminated with the pressure-sensitive adhesive layer to a side of the transparent conductive film where the transparent conductive layer is not provided, the pressure-sensitive adhesive layer has a storage elastic modulus of 80,000 Pa or less at 120&#xb0; C., and the adhesive strength between the pressure-sensitive adhesive layer and the coating layer is from 5 N/25 mm to 20 N/25 mm.

Transparent conductive laminate and touch panel

A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H&#x2212;Hof the dimensional change rate Hof the pattern forming part and the dimensional change rate Hof the pattern opening part in the heat treatment step is preferably less than 0.03%.

Method of manufacturing transparent conductive film

A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H-Hof the dimensional change rate Hof the pattern forming part and the dimensional change rate Hof the pattern opening part in the heat treatment step is preferably less than 0.03%.

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Ibaraki, Japan

Mari Tanabe