Resonac Corporation

Toshiba Materials Co., Ltd.

Shibaura Institute of Technology

Kirin Beer Kabushiki Kaisha

Mari Shimizu

Akira Shimizu

Tetsuo Inoue

Tomohiko Kotake

Takashi Hino

Shuichi Saito

Atsushi Yumoto

Satoshi Takayasu

Masaki Nakaya

Kouichi Aoyagi

Daisuke Fujimoto

Hiroyasu Tabuchi

Shin Takanezawa

Yasuo Kamigata

Harumi Negishi

Sayaka Kikuchi

Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

An aluminum nitride film includes a polycrystalline aluminum nitride. A withstand voltage of the aluminum nitride film is 100 kV/mm or more.

Aluminum nitride film, method of manufacturing aluminum nitride film, and high withstand voltage component

Growing community of inventors

Tokyo, Japan

Mari Shimizu