Hitachi, Ltd.

Mari Matsuyoshi

Yuji Fujita

Toyoki Asada

Naoya Kanda

Kazumi Kawamoto

Kunio Matsumoto

Hideo Sotokawa

Shinya Hamagishi

Kie Ueda

An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.

Electronic device and optical transmission module

The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.

Packaging structure and method of packaging electronic parts

Growing community of inventors

Yokohama, Japan

Mari Matsuyoshi