Hewlett-packard Development Company, L.P.

Mari J Rossman

Don Michael

Charles Craig Haluzak

Bradley Bower

Quan Qi

John Kane

John R Sterner

John R Stemer

A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.

Package for a micro-electro mechanical device

A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.

System and method for hermetically sealing a package

Growing community of inventors

Corvallis, OR, United States of America

Mari J Rossman