Cirrus Logic Inc.

Cirrus Logic International Semiconductor Limited

Marek Sebastian Piechocinski

Scott Lyall Cargill

Axel Thomsen

Richard Ian Laming

Tsjerk Hans Hoekstra

Colin Robert Jenkins

James Thomas Deas

Roberto Brioschi

Rkia Achehboune

Colin Wei Hong Chung

The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.

MEMS device and process

Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.

MEMS device

MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity from a region underlying the substrate.

MEMS devices and processes

The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. A conductive element is provided on the surface of the underlying membrane within the opening.

The application relates to MEMS microphone transducers having a vent structure provided in the membrane layer and an opening formed at the vent structure for tuning the frequency response of the microphone.

This application relates to MEMS transducer having a membrane layer () and at least one variable vent structure (). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover () which, at an equilibrium position, at least partly blocks the vent hole. The vent cover is moveable from its equilibrium position in response to a pressure differential across the vent cover so as to vary the size of a flow path through the vent hole. In various embodiments the vent cover comprises at least a first flap section () and a second flap section (), the first flap section being hingedly coupled to the side of the vent hole and the second flap section being hingedly coupled to the first flap section so as to be moveable with respect to the first flap section. In some embodiments the second flap section () may be configured so that it deflects away from the first section () more readily than the first section deflects away from its equilibrium position.

MEMS device and processes

MEMS devices with membrane having venting flaps hingedly attached to one another

The application describes MEMS transducers and associated methods of fabrication. The MEMS transducer has a flexible membrane with a vent structure comprising a moveable portion which opens in response to a differential pressure across the membrane to provide a flow path through the membrane. At least one edge of the moveable portion comprises one or more protrusions and/or recesses in the plane of the moveable portion.

Growing community of inventors

Edinburgh, United Kingdom

Marek Sebastian Piechocinski