Invensense, Inc.

Marek Matej

Igor Mucha

Stefano Riva

Pavol Tiković

Peter Pracny

A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.

Microphone MEMS diaphragm and self-test thereof

A feedback signal is employed to facilitate enhancing an acoustic overload point and electrostatic discharge protection of a sensor component and associated circuit. The sensor component comprises a backplate component and a diaphragm component. The backplate component is biased to a low-level voltage associated with a ground. The diaphragm component is biased to a defined high-voltage associated with a charge pump. The diaphragm component generates a signal based on movement of the diaphragm component in relation to the backplate component in response to the input signal. A feedback component receives the signal from the diaphragm component and generates an inverted signal based on the signal. The inverted signal or a processed inverted signal, which can be derived from a filter component that filters the inverted signal, is transmitted to the backplate component.

Sensor component with enhanced acoustic overload point and electrostatic discharge protection

The present invention relates to an integrated amplification circuit for a transducer signal comprising a semiconductor substrate. The semiconductor substrate comprises a signal limiting network comprising first and second parallel legs coupled between an input of a preamplifier and a first predetermined electric potential of the integrated amplification circuit. The first leg comprises a plurality of cascaded semiconductor diodes coupled to conduct current in a first direction through the limiting network and the second leg comprises a plurality of cascaded semiconductor diodes coupled to conduct current in a second direction through the limiting network. A current blocking member is configured to break a parasitic current path between an anode or a cathode of a semiconductor diode of the first leg or the second leg and the semiconductor substrate.

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Bratislava, Slovakia

Marek Matej