Koninklijke Philips Corporation N.v.

U.S. Philips Corporation

Marcus Toth

Joachim Heinz Schober

Gerald Schaffler

Peter Schmallegger

Heinz Kwas

Wolfgang Scheucher

Veronika Sauer

G&uuml;nter Aflenzer

Joachim Schober

Gunter Aflenzer

A data carrier ( ) includes an IC module ( ), having a substrate ( ), and a conductor configuration ( ) connected to the substrate ( ), and an IC ( ) connected to the substrate ( ), and connecting leads ( ) between the conductor configuration ( ) and the IC ( ), and a cover ( ) of an electrically insulating material, which cover ( ) shrouds the IC ( ) and the connecting leads ( ) and the portions ( ) of the conductor configuration ( ) The data carrier ( ) is equipped with a protection mechanism ( ) that provides protection against damage to at least a part of the IC module ( ) when the IC module ( ) is bent or twisted, which protection mechanism ( ) forms a part of the IC module ( ), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover ( ) up to the substrate means ( ).

Data carrier having an IC module with a protection mechanism for protecting the parts of the IC module from mechanical stress

A module ( ) for contactless communication includes a plurality of electrical components ( ) which each have at least two contact faces ( ) for the electrical connection. The electrical components ( ) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module ( ) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A , A , A , A , A , A ) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).

Module having a lead frame equipped with components on both sides

In a data carrier ( ) with a chip module ( ), the chip ( ) of the chip module ( ) is provided, in the region of its chip connecting layers ( ), with a respective wire connecting means which is formed by a flat metal layer ( ) and whereto an end ( ), bonded in a wedge-shape fashion, of a bond wire ( ) is connected.

Chip module with bond-wire connections with small loop height

The data carrier of a device provided with the data carrier includes a casing which is formed by injection molding and which accommodates a holding device for holding a chip and at least one transmission coil, and also includes an electrically conductive connector connected to the holding device and arranged to connect the chip terminals of the chip to the coil terminals of the transmission coil. The holding device includes a holding foil and the connector is realized while utilizing a conductor frame. The connector is formed by conductor segments of the conductor frame with parts of the conductor segments connected to the holding foil in order to hold the conductor segments. The entire holding foil and the parts of the conductor segments which are connected to the holding foil are fully enclosed by the casing.

Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component

The transmission coil (,) in a device (,) which includes a data carrier module (,) with a holding (,) and an integrated circuit (,) which is supported by the holding (,) and includes a transmission coil (,) which is electrically conductively connected to the integrated circuit (,) and to the holding (,), is covered, except for the area of its two coil connection contacts (,), by a protective layer (,) of an electrically insulating material, a connection wire being provided between each coil connection contact (,) and an associated circuit connection contact (,), the integrated circuit (,) and the two connection wires (,) and the areas of the two coil connection contacts (,) which are not covered by the protective layer (,) being protectively covered by a single protective cap (,).

Data carrier module device having integrated circuit and transmission coil connection contacts covered by a common protective cap

The data carrier (,) of a device (,) provided with a data carrier (,) includes a casing (,) which is formed by injection molding and in which there are accommodated holding means (,) for holding a chip (,) and at least one transmission coil (,), and also includes electrically conductive connection means (,) which are connected to the holding means (,) and are arranged to connect the chip terminals (,) of the chip (,) to the coil terminals (,) of the transmission coil (,); the holding means (,) include a holding foil (,) and the connection means (,) are realized while utilizing a conductor frame (,) and are formed by conductor segments (,) of the conductor frame (,) and are completely enclosed by the casing (,), at least parts of said conductor segments (,) being connected to the holding foil (,) in order to hold said conductor segments.

Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component

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Gratkorn, Austria

Marcus Toth